MIMX8MM6DVTLZAA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8MM6DVTLZAALast Revision (GMT):
Monday, 13 May 2024, 08:23:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8MM6DVTLZAASOT1967LFBGA486474.550000 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 783 385572023-11-24153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-12.5476002.0000000.536845
Epoxy ResinsOther Epoxy resins5.7321004.5000001.207902
Inorganic Silicon compoundsSilica, vitreous60676-86-070.05900055.00000014.763249
Inorganic Silicon compoundsSilicon dioxide7631-86-944.58300035.0000009.394795
Inorganic compoundsCarbon Black1333-86-40.6369000.5000000.134211
Phenols and Phenolic ResinsOther phenolic resins3.8214003.0000000.805268
Subtotal127.380000100.000000026.842272
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped10.06924889.6000002.121852
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1011420.9000000.021313
Nickel and its compoundsNickel, metal7440-02-00.0561900.5000000.011841
Silver and its compoundsSilver, metal7440-22-40.0354000.3150000.007460
Tin and its compoundsTin, metal7440-31-50.9760208.6850000.205673
Subtotal11.238000100.00000002.368138
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-41.7826203.5000000.375644
Tin and its compoundsTin, metal7440-31-549.14938096.50000010.357050
Subtotal50.932000100.000000010.732694
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-839.74954999.9800008.376261
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0079520.0200000.001676
Subtotal39.757500100.00000008.377937
SolderCopper and its compoundsCopper, metal7440-50-80.0065550.5000000.001381
Silver and its compoundsSilver, metal7440-22-40.0393303.0000000.008288
Tin and its compoundsTin, metal7440-31-51.26511596.5000000.266593
Subtotal1.311000100.00000000.276262
Solder MaskBarium and its compoundsBarium sulfate7727-43-72.07799219.6000000.437887
Inorganic Silicon compoundsSilicon dioxide7631-86-91.06020010.0000000.223412
Magnesium and its compoundsTalc14807-96-60.3180603.0000000.067023
Organic compoundsProprietary Material-Other organic compounds.0.6043145.7000000.127345
PolymersPlastic: EP - Epoxide, Epoxy1.33585212.6000000.281499
PolymersPlastic: PAK5.20558249.1000001.096951
Subtotal10.602000100.00000002.234116
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-38.94637810.3600001.885234
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-58.94637810.3600001.885234
Inorganic Silicon compoundsSilicon dioxide7631-86-940.27597246.6400008.487193
PolymersPlastic: EP - Epoxide, Epoxy28.18627232.6400005.939579
Subtotal86.355000100.000000018.197239
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-373.48725050.00000015.485671
Inorganic Silicon compoundsSilica, vitreous60676-86-029.39490020.0000006.194268
PolymersPlastic: EP - Epoxide, Epoxy44.09235030.0000009.291402
Subtotal146.974500100.000000030.971341
Total474.550000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8MM6DVTLZAA
Product content declaration of MIMX8MM6DVTLZAA
上次修订 Last Revision (GMT):
Monday, 13 May 2024, 08:23:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8MM6DVTLZAALast Revision (GMT):
Monday, 13 May 2024, 08:23:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
5 Dec 2023
Test Report
5 Dec 2023
Test Report
5 Dec 2023
Test Report
5 Dec 2023
Semiconductor DieDIENot AvailableNot AvailableNot AvailableNot Available
Solder Ball - Lead FreeTest Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
Substrate, Pre-plated NiAuAUS SR1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E705GTest Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
GX92Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
SAC305Test Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.