MIMX8MN1CVPIZAA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8MN1CVPIZAALast Revision (GMT):
Thursday, 03 November 2022, 12:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8MN1CVPIZAASOT2064TFBGA306234.320000 mg YesYesYesTin/Bismuth (SnBi)Othere6contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 216 015572023-11-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantInorganic Silicon compoundsSilica, vitreous60676-86-088.04880072.00000037.576306
Inorganic Silicon compoundsSilicon dioxide7631-86-910.3946508.5000004.436092
Inorganic compoundsCarbon Black1333-86-40.6114500.5000000.260947
Inorganic compoundsProprietary Material - Other inorganic compounds4.2801503.5000001.826626
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-44.2801503.5000001.826626
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.2801503.5000001.826626
PolymersPlastic: EP - Epoxide, Epoxy10.3946508.5000004.436092
Subtotal122.290000100.000000052.189314
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.09888089.6000009.857835
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2320200.9000000.099018
Nickel and its compoundsNickel, metal7440-02-00.1289000.5000000.055010
Silver and its compoundsSilver, metal7440-22-40.0812070.3150000.034656
Tin and its compoundsTin, metal7440-31-52.2389938.6850000.955528
Subtotal25.780000100.000000011.002048
Solder Ball - Lead Free with BismuthSolder Ball - Lead Free with BismuthBismuth and its compoundsBismuth, metal7440-69-90.9750003.0000000.416098
Copper and its compoundsCopper, metal7440-50-80.1625000.5000000.069350
Germanium and its compoundsGermanium7440-56-40.0032500.0100000.001387
Nickel and its compoundsNickel, metal7440-02-00.0162500.0500000.006935
Silver and its compoundsSilver, metal7440-22-41.3000004.0000000.554797
Tin and its compoundsTin, metal7440-31-530.04300092.44000012.821355
Subtotal32.500000100.000000013.869922
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-810.24372699.9900004.371682
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0010250.0100000.000437
Subtotal10.244750100.00000004.372119
Solder MaskAluminum and its compoundsAluminum Hydroxide21645-51-20.0217800.4000000.009295
Barium and its compoundsBarium sulfate7727-43-70.54448810.0000000.232369
Copper and its compoundsCopper phthalocyanine147-14-80.0108900.2000000.004647
Inorganic Silicon compoundsSilicon dioxide7631-86-90.54448810.0000000.232369
Magnesium and its compoundsTalc14807-96-60.65338512.0000000.278843
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2177954.0000000.092948
Organic compoundsProprietary Material-Other organic compounds.0.0108900.2000000.004647
PolymersPlastic: EP - Epoxide, Epoxy3.44116163.2000001.468573
Subtotal5.444875100.00000002.323692
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-320.55260254.0000008.771169
Inorganic Silicon compoundsSilicon dioxide7631-86-910.27630127.0000004.385584
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.9030195.0000000.812145
PolymersPlastic: EP - Epoxide, Epoxy5.32845314.0000002.274007
Subtotal38.060375100.000000016.242905
Total234.320000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8MN1CVPIZAA
Product content declaration of MIMX8MN1CVPIZAA
上次修订 Last Revision (GMT):
Thursday, 03 November 2022, 12:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-含铋无铅
Solder Ball - Lead Free with Bismuth
焊锡球-含铋无铅
Solder Ball - Lead Free with Bismuth
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8MN1CVPIZAALast Revision (GMT):
Thursday, 03 November 2022, 12:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Test Report
7 Nov 2023
Semiconductor DieTest Report
2 Feb 2023
Test Report
2 Feb 2023
Test Report
4 Feb 2022
Test Report
4 Feb 2022
Solder Ball - Lead Free with BismuthTest Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
SubstrateAUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CU FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
GHPL-830NS SERIESTest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.