MIMX8MN3DVTJZAA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8MN3DVTJZAALast Revision (GMT):
Saturday, 31 August 2024, 10:04:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8MN3DVTJZAASOT1967LFBGA486510.721000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 905 065572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-12.9801802.0000000.583524
Epoxy ResinsOther Epoxy resins6.7054054.5000001.312929
Inorganic Silicon compoundsSilica, vitreous60676-86-081.95495055.00000016.046912
Inorganic Silicon compoundsSilicon dioxide7631-86-952.15315035.00000010.211671
Inorganic compoundsCarbon Black1333-86-40.7450450.5000000.145881
Phenols and Phenolic ResinsOther phenolic resins4.4702703.0000000.875286
Subtotal149.009000100.000000029.176204
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.09888089.6000004.522798
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2320200.9000000.045430
Nickel and its compoundsNickel, metal7440-02-00.1289000.5000000.025239
Silver and its compoundsSilver, metal7440-22-40.0812070.3150000.015901
Tin and its compoundsTin, metal7440-31-52.2389938.6850000.438399
Subtotal25.780000100.00000005.047766
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-41.7826203.5000000.349040
Tin and its compoundsTin, metal7440-31-549.14938096.5000009.623528
Subtotal50.932000100.00000009.972568
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-859.04019099.98000011.560165
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0118100.0200000.002312
Subtotal59.052000100.000000011.562477
SolderCopper and its compoundsCopper, metal7440-50-80.0021380.5000000.000418
Silver and its compoundsSilver, metal7440-22-40.0128253.0000000.002511
Tin and its compoundsTin, metal7440-31-50.41253896.5000000.080776
Subtotal0.427500100.00000000.083705
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0105450.1000000.002065
Barium and its compoundsBarium sulfate7727-43-72.05627519.5000000.402622
Inorganic Silicon compoundsSilicon dioxide7631-86-91.0439559.9000000.204408
Magnesium and its compoundsTalc14807-96-60.3058052.9000000.059877
Organic compoundsOther organic compounds.0.5694305.4000000.111495
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0843600.8000000.016518
PolymersPlastic: EP - Epoxide, Epoxy1.30758012.4000000.256026
PolymersPlastic: PAK5.16705049.0000001.011717
Subtotal10.545000100.00000002.064728
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-32.58943010.3600000.507015
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.58943010.3600000.507015
Inorganic Silicon compoundsSilicon dioxide7631-86-911.65743546.6400002.282545
PolymersPlastic: EP - Epoxide, Epoxy8.15820532.6400001.597390
Subtotal24.994500100.00000004.893963
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-394.99050050.00000018.599294
Inorganic Silicon compoundsSilica, vitreous60676-86-056.99430030.00000011.159576
PolymersPlastic: EP - Epoxide, Epoxy37.99620020.0000007.439718
Subtotal189.981000100.000000037.198588
Total510.721000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8MN3DVTJZAA
Product content declaration of MIMX8MN3DVTJZAA
上次修订 Last Revision (GMT):
Saturday, 31 August 2024, 10:04:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8MN3DVTJZAALast Revision (GMT):
Saturday, 31 August 2024, 10:04:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
5 Dec 2023
Test Report
5 Dec 2023
Test Report
5 Dec 2023
Test Report
5 Dec 2023
Semiconductor DieDIENot AvailableNot AvailableNot AvailableNot Available
Solder Ball - Lead FreeTest Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
Test Report
16 Jan 2024
SubstrateAUS SR1Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E705GTest Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
GX92Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
SOLDERTest Report
31 Jan 2024
Test Report
31 Jan 2024
Test Report
31 Jan 2024
Test Report
31 Jan 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.