MIMX8QP6AVUFFAB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8QP6AVUFFABLast Revision (GMT):
Saturday, 06 March 2021, 04:16:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8QP6AVUFFABSOT1899BGA13135451.803000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 850 415572021-01-2883 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-525.15464072.0000000.461400
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones3.49370010.0000000.064083
Zinc and its compoundsZinc oxide1314-13-26.28866018.0000000.115350
Subtotal34.937000100.00000000.640834
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-78.65040040.0000000.158670
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-63.24390015.0000000.059501
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-29.73170045.0000000.178504
Subtotal21.626000100.00000000.396676
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-83381.76440098.00000062.030202
Nickel and its compoundsNickel, metal7440-02-069.0156002.0000001.265923
Subtotal3450.780000100.000000063.296124
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3271.37152089.6000004.977647
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.7258300.9000000.049999
Nickel and its compoundsNickel, metal7440-02-01.5143500.5000000.027777
Silver and its compoundsSilver, metal7440-22-40.9540400.3150000.017500
Tin and its compoundsTin, metal7440-31-526.3042608.6850000.482487
Subtotal302.870000100.00000005.555410
Solder Ball - Lead FreeSolder Ball - Lead FreeBismuth and its compoundsBismuth, metal7440-69-90.9177003.0000000.016833
Copper and its compoundsCopper, metal7440-50-80.1682450.5500000.003086
Germanium and its compoundsGermanium7440-56-40.0030590.0100000.000056
Nickel and its compoundsNickel, metal7440-02-00.0152950.0500000.000280
Silver and its compoundsSilver, metal7440-22-40.9177003.0000000.016833
Tin and its compoundsTin, metal7440-31-528.56800193.3900000.524010
Subtotal30.590000100.00000000.561099
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-76.6412500.4125000.121817
Copper and its compoundsCopper, metal7440-50-8568.87579035.33390010.434636
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-519.1139201.1872000.350598
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3355.86957022.1037006.527557
Inorganic Silicon compoundsSilica, vitreous60676-86-04.6979800.2918000.086173
Inorganic Silicon compoundsSilicon dioxide7631-86-966.7361104.1451001.224111
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-96.0745300.3773000.111422
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-6471.84753029.3073008.654890
PolymersOther polymers87.6290805.4428001.607341
Silver and its compoundsSilver, metal7440-22-40.6472200.0402000.011872
Tin and its compoundsTin, metal7440-31-521.8670201.3582000.401097
Subtotal1610.000000100.000000029.531515
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-00.60000060.0000000.011005
Inorganic compoundsCarbon Black1333-86-40.0010000.1000000.000018
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0090000.9000000.000165
PolymersPlastic: EP - Epoxide, Epoxy0.39000039.0000000.007154
Subtotal1.000000100.00000000.018343
Total5451.803000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8QP6AVUFFAB
Product content declaration of MIMX8QP6AVUFFAB
上次修订 Last Revision (GMT):
Saturday, 06 March 2021, 04:16:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8QP6AVUFFABLast Revision (GMT):
Saturday, 06 March 2021, 04:16:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Epoxy AdhesiveTest Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Test Report
9 Mar 2020
Heat SpreaderTest Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Semiconductor DieTest Report
16 Feb 2021
Test Report
16 Feb 2021
Test Report
5 Apr 2019
Test Report
5 Apr 2019
Solder Ball - Lead FreeTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
SubstrateCOPPER FOILTest Report
7 Jan 2021Test Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
E700GRNot AvailableTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
GX13Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
LF 204Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
SR7300Test Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
1 Apr 2019
UnderfillTest Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.