MIMX8QP6CVUFFAB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MIMX8QP6CVUFFABLast Revision (GMT):
Tuesday, 03 August 2021, 05:42:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MIMX8QP6CVUFFABSOT1899BGA13135772.274000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 850 425572021-03-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-78.65040040.0000000.149861
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-63.24390015.0000000.056198
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-29.73170045.0000000.168594
Subtotal21.626000100.00000000.374653
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-83381.76440098.00000058.586346
Nickel and its compoundsNickel, metal7440-02-069.0156002.0000001.195640
Subtotal3450.780000100.000000059.781985
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3271.37152089.6000004.701293
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.7258300.9000000.047223
Nickel and its compoundsNickel, metal7440-02-01.5143500.5000000.026235
Silver and its compoundsSilver, metal7440-22-40.9540400.3150000.016528
Tin and its compoundsTin, metal7440-31-526.3042608.6850000.455700
Subtotal302.870000100.00000005.246979
Solder Ball - Lead FreeSolder Ball - Lead FreeBismuth and its compoundsBismuth, metal7440-69-99.6177603.0000000.166620
Copper and its compoundsCopper, metal7440-50-81.7632560.5500000.030547
Germanium and its compoundsGermanium7440-56-40.0320590.0100000.000555
Nickel and its compoundsNickel, metal7440-02-00.1602960.0500000.002777
Silver and its compoundsSilver, metal7440-22-49.6177603.0000000.166620
Tin and its compoundsTin, metal7440-31-5299.40086993.3900005.186879
Subtotal320.592000100.00000005.553998
SubstrateSubstrateBarium and its compoundsBarium sulfate7727-43-76.6412500.4125000.115054
Copper and its compoundsCopper, metal7440-50-8568.87579035.3339009.855315
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-519.1139201.1872000.331133
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3355.86957022.1037006.165154
Inorganic Silicon compoundsSilica, vitreous60676-86-04.6979800.2918000.081389
Inorganic Silicon compoundsSilicon dioxide7631-86-966.7361104.1451001.156149
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-96.0745300.3773000.105236
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-6471.84753029.3073008.174379
PolymersOther polymers87.6290805.4428001.518103
Silver and its compoundsSilver, metal7440-22-40.6472200.0402000.011213
Tin and its compoundsTin, metal7440-31-521.8670201.3582000.378829
Subtotal1610.000000100.000000027.891954
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-525.15464072.0000000.435784
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones3.49370010.0000000.060526
Zinc and its compoundsZinc oxide1314-13-26.28866018.0000000.108946
Subtotal34.937000100.00000000.605255
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-018.88140060.0000000.327105
Inorganic compoundsCarbon Black1333-86-40.0314690.1000000.000545
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2832210.9000000.004907
PolymersPlastic: EP - Epoxide, Epoxy12.27291039.0000000.212618
Subtotal31.469000100.00000000.545175
Total5772.274000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MIMX8QP6CVUFFAB
Product content declaration of MIMX8QP6CVUFFAB
上次修订 Last Revision (GMT):
Tuesday, 03 August 2021, 05:42:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MIMX8QP6CVUFFABLast Revision (GMT):
Tuesday, 03 August 2021, 05:42:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Heat SpreaderTest Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Test Report
17 Apr 2019
Semiconductor DieTest Report
16 Feb 2021
Test Report
16 Feb 2021
Test Report
5 Apr 2019
Test Report
5 Apr 2019
Solder Ball - Lead FreeTest Report
17 Dec 2020
Test Report
17 Dec 2020
Test Report
17 Dec 2020
Test Report
17 Dec 2020
SubstrateCOPPER FOILTest Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
Test Report
22 Jan 2019
E700GRTest Report
7 Jan 2021
Not AvailableTest Report
7 Jan 2021
Test Report
14 Jan 2020
GX13Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
Test Report
13 Sep 2019
LF 204Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
Test Report
16 Jan 2019
SR7300Test Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
Test Report
27 Mar 2020
Thermally Conductive GelTest Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
UnderfillTest Report
18 Feb 2021
Test Report
18 Feb 2021
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.