MK21FX512VMD12

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK21FX512VMD12Last Revision (GMT):
Saturday, 09 December 2023, 07:37:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK21FX512VMD12SOT1535-1LBGA144462.874754 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 177 175572023-11-2493 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-83.58901497.0000000.775375
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1110003.0000000.023981
Subtotal3.700014100.00000000.799355
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.1720006.0000003.061735
Inorganic Silicon compoundsSilica, vitreous60676-86-0174.78800074.00000037.761403
Inorganic Silicon compoundsSilicon dioxide7631-86-935.43000015.0000007.654338
Inorganic compoundsCarbon Black1333-86-41.1810000.5000000.255145
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-44.7240002.0000001.020579
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins5.9050002.5000001.275723
Subtotal236.200000100.000000051.028923
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.67500045.0000000.145828
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001500.0100000.000032
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.016203
PolymersPlastic: EP - Epoxide, Epoxy0.74985049.9900000.161998
Subtotal1.500000100.00000000.324062
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped21.84884598.0000004.720250
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4458952.0000000.096332
Subtotal22.294740100.00000004.816581
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.4359000.5000000.094172
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0185690.0213000.004012
Silver and its compoundsSilver, metal7440-22-43.4872004.0000000.753379
Tin and its compoundsTin, metal7440-31-583.23833195.47870017.982906
Subtotal87.180000100.000000018.834468
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-812.20677999.9900002.637167
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012210.0100000.000264
Subtotal12.208000100.00000002.637430
Copper Foil 2Copper and its compoundsCopper, metal7440-50-814.26737399.9900003.082340
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014270.0100000.000308
Subtotal14.268800100.00000003.082648
Copper PlatingCopper and its compoundsCopper, metal7440-50-826.61973899.9900005.750959
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0026620.0100000.000575
Subtotal26.622400100.00000005.751534
Gold PlatingGold and its compoundsGold, metal7440-57-51.59024199.9900000.343558
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001590.0100000.000034
Subtotal1.590400100.00000000.343592
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0015380.0100000.000332
Nickel and its compoundsNickel, metal7440-02-015.37606299.9900003.321862
Subtotal15.377600100.00000003.322195
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.79581929.1000000.387971
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0370270.6000000.007999
Magnesium and its compoundsTalc14807-96-60.1851363.0000000.039997
Organic compoundsOther organic compounds.0.2221633.6000000.047996
PolymersPlastic: EP - Epoxide, Epoxy1.20955519.6000000.261314
PolymersPlastic: PAK2.72149944.1000000.587956
Subtotal6.171200100.00000001.333233
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-34.77747232.0000001.032131
Inorganic Silicon compoundsSilica, vitreous60676-86-00.8957766.0000000.193524
PolymersPlastic: PI - Polyimide9.25635262.0000001.999753
Subtotal14.929600100.00000003.225408
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-37.70784037.0000001.665211
Inorganic Silicon compoundsSilica, vitreous60676-86-03.33312016.0000000.720091
PolymersPlastic: PI - Polyimide9.79104047.0000002.115268
Subtotal20.832000100.00000004.500570
Total462.874754100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK21FX512VMD12
Product content declaration of MK21FX512VMD12
上次修订 Last Revision (GMT):
Saturday, 09 December 2023, 07:37:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK21FX512VMD12Last Revision (GMT):
Saturday, 09 December 2023, 07:37:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
20 Feb 2024
Test Report
20 Feb 2024
Test Report
20 Feb 2024
Test Report
20 Feb 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
Test Report
17 Feb 2023
AUS308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
7 Oct 2023
Test Report
7 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
10 May 2023
Test Report
10 May 2023
Test Report
10 May 2023
Test Report
10 May 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.