MK22FN1M0VMC12R

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MK22FN1M0VMC12RLast Revision (GMT):
Wednesday, 23 October 2024, 11:06:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK22FN1M0VMC12RSOT1533-1LFBGA121185.892137 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 118 775182023-11-2463 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-816.67662597.0000008.971130
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5157723.0000000.277458
Subtotal17.192397100.00000009.248587
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins4.2240006.0000002.272286
Inorganic Silicon compoundsSilica, vitreous60676-86-052.09600074.00000028.024854
Inorganic Silicon compoundsSilicon dioxide7631-86-910.56000015.0000005.680714
Inorganic compoundsCarbon Black1333-86-40.3520000.5000000.189357
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-41.4080002.0000000.757428
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.7600002.5000000.946786
Subtotal70.400000100.000000037.871424
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.26000045.0000000.677812
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0002800.0100000.000151
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1400005.0000000.075313
PolymersPlastic: EP - Epoxide, Epoxy1.39972049.9900000.752974
Subtotal2.800000100.00000001.506250
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped21.84884598.00000011.753507
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4458952.0000000.239868
Subtotal22.294740100.000000011.993374
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0660250.5000000.035518
Silver and its compoundsSilver, metal7440-22-40.1320501.0000000.071036
Tin and its compoundsTin, metal7440-31-513.00692598.5000006.997028
Subtotal13.205000100.00000007.103582
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-818.49015199.9900009.946710
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0018490.0100000.000995
Subtotal18.492000100.00000009.947704
Copper PlatingCopper and its compoundsCopper, metal7440-50-816.74265199.9800009.006648
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0033490.0200000.001802
Subtotal16.746000100.00000009.008450
Gold PlatingGold and its compoundsGold, metal7440-57-50.22797799.9900000.122639
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000230.0100000.000012
Subtotal0.228000100.00000000.122652
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004320.0300000.000232
Nickel and its compoundsNickel, metal7440-02-01.43956899.9700000.774410
Subtotal1.440000100.00000000.774643
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0083760.1000000.004506
Barium and its compoundsBarium sulfate7727-43-72.43741629.1000001.311199
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0502560.6000000.027035
Magnesium and its compoundsTalc14807-96-60.2512803.0000000.135175
Organic compoundsOther organic compounds.0.3015363.6000000.162210
PolymersPlastic: EP - Epoxide, Epoxy1.63332019.5000000.878639
PolymersPlastic: PAK3.69381644.1000001.987075
Subtotal8.376000100.00000004.505839
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.84672032.0000000.455490
Inorganic Silicon compoundsSilica, vitreous60676-86-00.1587606.0000000.085404
PolymersPlastic: PI - Polyimide1.64052062.0000000.882512
Subtotal2.646000100.00000001.423406
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-34.46664037.0000002.402813
Inorganic Silicon compoundsSilica, vitreous60676-86-01.93152016.0000001.039054
PolymersPlastic: PI - Polyimide5.67384047.0000003.052222
Subtotal12.072000100.00000006.494089
Total185.892137100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK22FN1M0VMC12R
Product content declaration of MK22FN1M0VMC12R
上次修订 Last Revision (GMT):
Wednesday, 23 October 2024, 11:06:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK22FN1M0VMC12RLast Revision (GMT):
Wednesday, 23 October 2024, 11:06:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
6 Mar 2024
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG_GEA679FGNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.