MK22FN512VDC12R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK22FN512VDC12RLast Revision (GMT):
Monday, 19 September 2022, 07:12:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK22FN512VDC12RSOT1557XFBGA12170.273015 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 219 785182023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.78481098.0994001.116801
Gold and its compoundsGold, metal7440-57-50.0008000.1000000.001138
Palladium and its compoundsPalladium, metal7440-05-30.0144051.8006000.020499
Subtotal0.800015100.00000001.138438
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.5600006.0000002.219913
Inorganic Silicon compoundsSilica, vitreous60676-86-019.24000074.00000027.378931
Inorganic Silicon compoundsSilicon dioxide7631-86-93.90000015.0000005.549783
Inorganic compoundsCarbon Black1333-86-40.1300000.5000000.184993
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.5200002.0000000.739971
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6500002.5000000.924964
Subtotal26.000000100.000000036.998555
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.07000010.0000000.099612
Inorganic Silicon compoundsSilicon dioxide7631-86-90.17500025.0000000.249029
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.21000030.0000000.298835
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.17500025.0000000.249029
PolymersAcrylic acid ester copolymer78506-70-40.07000010.0000000.099612
Subtotal0.700000100.00000000.996115
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped20.13900098.00000028.658227
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4110002.0000000.584862
Subtotal20.550000100.000000029.243089
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0186600.5012000.026553
Silver and its compoundsSilver, metal7440-22-40.0373191.0024000.053106
Tin and its compoundsTin, metal7440-31-53.66702198.4964005.218249
Subtotal3.723000100.00000005.297908
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0001690.0050000.000241
Copper and its compoundsCopper, metal7440-50-83.38111299.9250004.811395
Nickel and its compoundsNickel, metal7440-02-00.0006770.0200000.000963
Zinc and its compoundsZinc, metal7440-66-60.0016920.0500000.002407
Subtotal3.383650100.00000004.815006
Copper PlatingCopper and its compoundsCopper, metal7440-50-85.35039499.9000007.613725
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0053560.1000000.007621
Subtotal5.355750100.00000007.621346
Gold PlatingGold and its compoundsGold, metal7440-57-50.45649399.9000000.649599
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0004570.1000000.000650
Subtotal0.456950100.00000000.650250
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0021150.1000000.003009
Nickel and its compoundsNickel, metal7440-02-02.11243599.9000003.006041
Subtotal2.114550100.00000003.009050
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.02555729.1000001.459389
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0211460.6000000.030090
Magnesium and its compoundsTalc14807-96-60.1057283.0000000.150452
Organic compoundsOther organic compounds.0.1268733.6000000.180543
PolymersPlastic: EP - Epoxide, Epoxy0.69075319.6000000.982956
PolymersPlastic: PAK1.55419444.1000002.211652
Subtotal3.524250100.00000005.015083
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.79893721.8000001.136905
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31.64185344.8000002.336392
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0439781.2000000.062582
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2345506.4000000.333770
Phenols - SpecificBisphenol A80-05-70.0366491.0000000.052152
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.52773814.4000000.750983
PolymersPlastic: EP - Epoxide, Epoxy0.38114410.4000000.542377
Subtotal3.664850100.00000005.215160
Total70.273015100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK22FN512VDC12R
Product content declaration of MK22FN512VDC12R
上次修订 Last Revision (GMT):
Monday, 19 September 2022, 07:12:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK22FN512VDC12RLast Revision (GMT):
Monday, 19 September 2022, 07:12:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Not Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
AUS308Test Report
22 Aug 2022
Test Report
22 Aug 2022
Test Report
22 Aug 2022
Test Report
22 Aug 2022
COPPER FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
HL832NXATest Report
8 Feb 2023
Test Report
8 Feb 2023
Test Report
11 Mar 2022
Test Report
8 Feb 2023
NI PLATINGTest Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
Test Report
6 Apr 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.