MK51DN256ZCMD10

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MK51DN256ZCMD10Last Revision (GMT):
Monday, 19 September 2022, 10:47:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK51DN256ZCMD10SOT1535-1LBGA144479.880014 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 256 735572020-06-173 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-83.58901497.0000000.747898
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1110003.0000000.023131
Subtotal3.700014100.00000000.771029
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.1720006.0000002.953238
Inorganic Silicon compoundsSilica, vitreous60676-86-0174.78800074.00000036.423271
Inorganic Silicon compoundsSilicon dioxide7631-86-935.43000015.0000007.383096
Inorganic compoundsCarbon Black1333-86-41.1810000.5000000.246103
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-44.7240002.0000000.984413
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins5.9050002.5000001.230516
Subtotal236.200000100.000000049.220637
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.67500045.0000000.140660
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001500.0100000.000031
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.015629
PolymersPlastic: EP - Epoxide, Epoxy0.74985049.9900000.156258
Subtotal1.500000100.00000000.312578
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped38.51400098.0000008.025756
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7860002.0000000.163791
Subtotal39.300000100.00000008.189547
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.4359000.5000000.090835
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0185690.0213000.003870
Silver and its compoundsSilver, metal7440-22-43.4872004.0000000.726682
Tin and its compoundsTin, metal7440-31-583.23833195.47870017.345655
Subtotal87.180000100.000000018.167041
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-813.09280099.9900002.728349
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0013090.0100000.000273
Subtotal13.094109100.00000002.728622
Copper Foil 2Copper and its compoundsCopper, metal7440-50-815.29920099.9900003.188130
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0015300.0100000.000319
Subtotal15.300730100.00000003.188449
Copper PlatingCopper and its compoundsCopper, metal7440-50-822.59040199.9900004.707510
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0022590.0100000.000471
Subtotal22.592660100.00000004.707981
Gold PlatingGold and its compoundsGold, metal7440-57-51.70240099.9900000.354755
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001700.0100000.000036
Subtotal1.702570100.00000000.354791
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0016500.0100000.000344
Nickel and its compoundsNickel, metal7440-02-016.49760099.9900003.437859
Subtotal16.499250100.00000003.438203
Solder MaskBarium and its compoundsBarium sulfate7727-43-71.92312029.1000000.400750
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0396520.6000000.008263
Magnesium and its compoundsTalc14807-96-60.1982603.0000000.041314
Organic compoundsOther organic compounds.0.2379123.6000000.049577
PolymersPlastic: EP - Epoxide, Epoxy1.29529719.6000000.269921
PolymersPlastic: PAK2.91441944.1000000.607322
Subtotal6.608661100.00000001.377149
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-35.12204832.0000001.067360
Inorganic Silicon compoundsSilica, vitreous60676-86-00.9603846.0000000.200130
PolymersPlastic: PI - Polyimide9.92396862.0000002.068010
Subtotal16.006401100.00000003.335501
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-37.47237937.0000001.557135
Inorganic Silicon compoundsSilica, vitreous60676-86-03.23129916.0000000.673356
PolymersPlastic: PI - Polyimide9.49194147.0000001.977982
Subtotal20.195619100.00000004.208473
Total479.880014100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK51DN256ZCMD10
Product content declaration of MK51DN256ZCMD10
上次修订 Last Revision (GMT):
Monday, 19 September 2022, 10:47:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK51DN256ZCMD10Last Revision (GMT):
Monday, 19 September 2022, 10:47:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
12 Nov 2021
Test Report
12 Nov 2021
Test Report
12 Nov 2021
Test Report
12 Nov 2021
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Semiconductor DieTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
27 Apr 2022
Not Available
Solder Ball - SAC, Lead FreeTest Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
24 Sep 2019
Substrate, Pre-plated NiAuAU PLATINGTest Report
22 Feb 2022
Test Report
22 Feb 2022
Test Report
22 Feb 2022
Test Report
22 Feb 2022
AUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
CU PLATINGTest Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
Test Report
2 Jul 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
NI PLATINGTest Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.