MK60FN1M0VMD12R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK60FN1M0VMD12RLast Revision (GMT):
Friday, 04 June 2021, 12:36:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK60FN1M0VMD12RSOT1535-1LBGA144475.880014 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 176 255182020-06-1933 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-83.58901497.0000000.754185
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1110003.0000000.023325
Subtotal3.700014100.00000000.777510
Die EncapsulantDie EncapsulantAluminum and its compoundsOther aluminum compounds7.0860003.0000001.489031
Epoxy ResinsOther Non-halogenated Epoxy resins11.8100005.0000002.481718
Inorganic Silicon compoundsSilica, vitreous60676-86-0200.77000085.00000042.189206
Inorganic compoundsCarbon Black1333-86-42.3620001.0000000.496344
Phenols and Phenolic ResinsOther phenolic resins7.0860003.0000001.489031
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-47.0860003.0000001.489031
Subtotal236.200000100.000000049.634360
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.67500045.0000000.141843
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001500.0100000.000031
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.015760
PolymersPlastic: EP - Epoxide, Epoxy0.74985049.9900000.157571
Subtotal1.500000100.00000000.315206
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped34.59400098.0000007.269480
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7060002.0000000.148357
Subtotal35.300000100.00000007.417836
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.4359000.5000000.091599
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0185690.0213000.003902
Silver and its compoundsSilver, metal7440-22-43.4872004.0000000.732790
Tin and its compoundsTin, metal7440-31-583.23833195.47870017.491453
Subtotal87.180000100.000000018.319744
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-24.5315204.0460000.952240
Aromatic amines and their saltsOther aromatic amines and their salts0.0201600.0180000.004236
Aromatic hydrocarbon compounds1,2,4-Trimethylbenzene95-63-60.0060480.0054000.001271
Aromatic hydrocarbon compoundsOther Aromatic carbonyl compounds0.1276800.1140000.026830
Barium and its compoundsBarium sulfate7727-43-70.6811840.6082000.143142
Copper and its compoundsCopper phthalocyanine147-14-80.0060480.0054000.001271
Copper and its compoundsCopper, metal7440-50-850.97680045.51500010.712112
Epoxy ResinsOther Epoxy resins4.4116803.9390000.927057
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.8187681.6239000.382190
Epoxy ResinsProprietary Material-Other Epoxy resins2.1698881.9374000.455974
Gold and its compoundsGold, metal7440-57-51.6128001.4400000.338909
Inorganic Silicon compoundsFibrous-glass-wool65997-17-325.03312022.3510005.260385
Inorganic Silicon compoundsSilicon dioxide7631-86-93.2842882.9324000.690150
Magnesium and its compoundsTalc14807-96-60.3431680.3064000.072112
Nickel and its compoundsNickel, metal7440-02-012.58644811.2379002.644878
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.7468160.6668000.156934
Organic compoundsBis(3-ethyl-5-methyl-4-maleimidophenyl)methane105391-33-11.8187681.6239000.382190
Organic compoundsQuinacridone pigment1047-16-10.0060480.0054000.001271
PolymersTriazine25722-66-11.8187681.6239000.382190
Subtotal112.000000100.000000023.535345
Total475.880014100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK60FN1M0VMD12R
Product content declaration of MK60FN1M0VMD12R
上次修订 Last Revision (GMT):
Friday, 04 June 2021, 12:36:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK60FN1M0VMD12RLast Revision (GMT):
Friday, 04 June 2021, 12:36:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveTest Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Semiconductor DieTest Report
19 Aug 2020
Test Report
19 Aug 2020
Test Report
19 Aug 2020
Not Available
Solder Ball - SAC, Lead FreeTest Report
24 Sep 2019
Test Report
24 Sep 2019
Test Report
24 Sep 2019
Test Report
24 Sep 2019
Substrate, Pre-plated NiAuAUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
22 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.