MK64FN1M0VDC12

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK64FN1M0VDC12Last Revision (GMT):
Wednesday, 06 March 2024, 08:27:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK64FN1M0VDC12SOT1557XFBGA12153.823015 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 186 825572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.78481098.0994001.458131
Gold and its compoundsGold, metal7440-57-50.0008000.1000000.001486
Palladium and its compoundsPalladium, metal7440-05-30.0144051.8006000.026764
Subtotal0.800015100.00000001.486381
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.5600006.0000002.898388
Inorganic Silicon compoundsSilica, vitreous60676-86-019.24000074.00000035.746790
Inorganic Silicon compoundsSilicon dioxide7631-86-93.90000015.0000007.245971
Inorganic compoundsCarbon Black1333-86-40.1300000.5000000.241532
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.5200002.0000000.966129
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.6500002.5000001.207662
Subtotal26.000000100.000000048.306473
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.07000010.0000000.130056
Inorganic Silicon compoundsSilicon dioxide7631-86-90.17500025.0000000.325140
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.21000030.0000000.390168
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.17500025.0000000.325140
PolymersAcrylic acid ester copolymer78506-70-40.07000010.0000000.130056
Subtotal0.700000100.00000001.300559
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped4.01800098.0000007.465208
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0820002.0000000.152351
Subtotal4.100000100.00000007.617559
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0186600.5012000.034669
Silver and its compoundsSilver, metal7440-22-40.0373191.0024000.069337
Tin and its compoundsTin, metal7440-31-53.66702198.4964006.813110
Subtotal3.723000100.00000006.917115
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-20.4682352.5310000.869953
Aluminum and its compoundsAluminum, metal7429-90-50.0472120.2552000.087717
Arsenic and its compoundsArsenic, metal7440-38-20.0021830.0118000.004056
Barium and its compoundsBarium sulfate7727-43-70.4947462.6743000.919208
Copper and its compoundsCopper, metal7440-50-86.72708136.36260012.498521
Epoxy ResinsMethacrylic acid, polymer with 2,2-bis(p-(2,3-epoxypropoxy)phenyl)propane26875-67-21.2157836.5718002.258853
Gold and its compoundsGold, metal7440-57-51.0339285.5888001.920978
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.9761345.2764001.813600
Magnesium and its compoundsMagnesium, metal7439-95-40.1668700.9020000.310035
Nickel and its compoundsNickel, metal7440-02-06.73105836.38410012.505911
Organic Silicon compoundsOther organic Silicon Compounds0.0178160.0963000.033100
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.3957892.1394000.735353
Organic compoundsDipropylene glycol monomethyl ether34590-94-80.1978951.0697000.367676
Phosphorus compoundsOther inorganic phosphorous compounds0.0015540.0084000.002887
Zinc and its compoundsZinc, metal7440-66-60.0237170.1282000.044065
Subtotal18.500000100.000000034.371913
Total53.823015100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK64FN1M0VDC12
Product content declaration of MK64FN1M0VDC12
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 08:27:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK64FN1M0VDC12Last Revision (GMT):
Wednesday, 06 March 2024, 08:27:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAUS 308Test Report
10 Jul 2023
Test Report
10 Jul 2023
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
7 Oct 2023
Test Report
7 Oct 2023
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
11 Mar 2022
Test Report
29 Dec 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.