MKL15Z32VLK4

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MKL15Z32VLK4Last Revision (GMT):
Tuesday, 11 October 2022, 06:04:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MKL15Z32VLK4SOT315-2LQFP80478.300597 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 233 425572020-06-1963 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.00099999.9900000.000209
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.001000100.00000000.000209
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-842.62806797.3000008.912401
Iron and its compoundsIron, metal7439-89-61.0514632.4000000.219833
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0438110.1000000.009160
Zinc and its compoundsZinc, metal7440-66-60.0876220.2000000.018319
Subtotal43.810963100.00000009.159713
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0015890.1000000.000332
Silver and its compoundsSilver, metal7440-22-41.58741099.9000000.331885
Subtotal1.588999100.00000000.332218
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-51.0606930.2504000.221763
Epoxy ResinsProprietary Material-Other Epoxy resins3.8183270.9014000.798311
Inorganic Silicon compoundsSilicon dioxide7631-86-9372.68677787.98090077.918945
Magnesium and its compoundsMagnesium, metal7439-95-43.1820810.7512000.665289
Organic Phosphorus compoundsOther organic phosphorous compounds2.1213870.5008000.443526
Organic Silicon compoundsOther organic Silicon Compounds1.6969400.4006000.354785
Organic Silicon compoundsSilicone modified epoxy resin218163-11-239.0334369.2147008.160859
Subtotal423.599642100.000000088.563478
Epoxy AdhesiveEpoxy AdhesiveAcrylates2-propenoic acid, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester24447-78-70.0280007.0000000.005854
AcrylatesDicyclopentenyloxyethyl acrylate65983-31-50.0180004.5000000.003763
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0080002.0000000.001673
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0044001.1000000.000920
Organic compoundsOther Organic Peroxides0.0012000.3000000.000251
Polymers1,3-Butadiene, homopolymer, epoxidized, cyclized68441-49-60.0160004.0000000.003345
PolymersPoly(acrylonitrile-co-butadiene-co-acrylic acid), dicarboxy terminated68891-50-90.0044001.1000000.000920
Silver and its compoundsSilver, metal7440-22-40.32000080.0000000.066904
Subtotal0.400000100.00000000.083629
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0010400.0200000.000217
Tin and its compoundsTin, metal7440-31-55.19895699.9800001.086964
Subtotal5.199996100.00000001.087182
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped3.62599798.0000000.758100
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0740002.0000000.015471
Subtotal3.699997100.00000000.773571
Total478.300597100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MKL15Z32VLK4
Product content declaration of MKL15Z32VLK4
上次修订 Last Revision (GMT):
Tuesday, 11 October 2022, 06:04:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MKL15Z32VLK4Last Revision (GMT):
Tuesday, 11 October 2022, 06:04:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Test Report
15 Apr 2022
Copper Lead-FrameAG PLATINGTest Report
12 Oct 2021
Test Report
12 Oct 2021
Test Report
12 Oct 2021
Test Report
12 Oct 2021
C194Test Report
14 Oct 2021
Test Report
14 Oct 2021
Test Report
14 Oct 2021
Test Report
14 Oct 2021
Die EncapsulantTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
12 Jul 2022
Test Report
12 Jul 2022
Test Report
12 Jul 2022
Test Report
12 Jul 2022
Post-plating - Lead FreeTest Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Semiconductor DieTest Report
27 Apr 2022
Test Report
27 Apr 2022
Test Report
27 Apr 2022
Test Report
27 Apr 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.