MKL17Z32VDA4R

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MKL17Z32VDA4RLast Revision (GMT):
Monday, 19 September 2022, 07:35:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MKL17Z32VDA4RSOT1558-1XFBGA3614.868453 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 185 835182020-07-363 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.09808398.0994000.659670
Gold and its compoundsGold, metal7440-57-50.0001000.1000000.000673
Palladium and its compoundsPalladium, metal7440-05-30.0018001.8006000.012108
Subtotal0.099983100.00000000.672451
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.3660006.0000002.461588
Inorganic Silicon compoundsSilica, vitreous60676-86-04.51400074.00000030.359581
Inorganic Silicon compoundsSilicon dioxide7631-86-90.91500015.0000006.153969
Inorganic compoundsCarbon Black1333-86-40.0305000.5000000.205132
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.1220002.0000000.820529
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.1525002.5000001.025662
Subtotal6.100000100.000000041.026460
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.02000010.0000000.134513
Inorganic Silicon compoundsSilicon dioxide7631-86-90.05000025.0000000.336282
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.06000030.0000000.403539
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.05000025.0000000.336282
PolymersAcrylic acid ester copolymer78506-70-40.02000010.0000000.134513
Subtotal0.200000100.00000001.345130
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped4.86126198.00000032.695134
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0992092.0000000.667248
Subtotal4.960470100.000000033.362381
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0055530.5012000.037350
Silver and its compoundsSilver, metal7440-22-40.0111071.0024000.074699
Tin and its compoundsTin, metal7440-31-51.09134098.4964007.339971
Subtotal1.108000100.00000007.452019
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-20.0607442.5310000.408543
Aluminum and its compoundsAluminum, metal7429-90-50.0061250.2552000.041193
Arsenic and its compoundsArsenic, metal7440-38-20.0002830.0118000.001905
Barium and its compoundsBarium sulfate7727-43-70.0641832.6743000.431674
Copper and its compoundsCopper, metal7440-50-80.87270236.3626005.869490
Epoxy ResinsMethacrylic acid, polymer with 2,2-bis(p-(2,3-epoxypropoxy)phenyl)propane26875-67-20.1577236.5718001.060791
Gold and its compoundsGold, metal7440-57-50.1341315.5888000.902119
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.1266345.2764000.851693
Magnesium and its compoundsMagnesium, metal7439-95-40.0216480.9020000.145597
Nickel and its compoundsNickel, metal7440-02-00.87321836.3841005.872961
Organic Silicon compoundsOther organic Silicon Compounds0.0023110.0963000.015544
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.0513462.1394000.345332
Organic compoundsDipropylene glycol monomethyl ether34590-94-80.0256731.0697000.172666
Phosphorus compoundsOther inorganic phosphorous compounds0.0002020.0084000.001356
Zinc and its compoundsZinc, metal7440-66-60.0030770.1282000.020694
Subtotal2.400000100.000000016.141558
Total14.868453100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MKL17Z32VDA4R
Product content declaration of MKL17Z32VDA4R
上次修订 Last Revision (GMT):
Monday, 19 September 2022, 07:35:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MKL17Z32VDA4RLast Revision (GMT):
Monday, 19 September 2022, 07:35:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Not Available
Semiconductor DieTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
27 Apr 2022
Not Available
Solder Ball - SAC, Lead FreeTest Report
9 Nov 2021
Test Report
9 Nov 2021
Test Report
9 Nov 2021
Test Report
9 Nov 2021
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPER FOILTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.