MKL82Z128VMC7

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MKL82Z128VMC7Last Revision (GMT):
Tuesday, 05 March 2024, 02:11:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MKL82Z128VMC7SOT1533-2LFBGA121278.137416 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 160 555572023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.23500498.1000000.084492
Gold and its compoundsGold, metal7440-57-50.0002400.1000000.000086
Palladium and its compoundsPalladium, metal7440-05-30.0043121.8000000.001550
Subtotal0.239556100.00000000.086129
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins11.7840006.0000004.236755
Inorganic Silicon compoundsSilica, vitreous60676-86-0145.33600074.00000052.253308
Inorganic Silicon compoundsSilicon dioxide7631-86-929.46000015.00000010.591887
Inorganic compoundsCarbon Black1333-86-40.9820000.5000000.353063
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-43.9280002.0000001.412252
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.9100002.5000001.765314
Subtotal196.400000100.000000070.612578
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.76500045.0000000.275044
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001700.0100000.000061
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0850005.0000000.030560
PolymersPlastic: EP - Epoxide, Epoxy0.84983049.9900000.305543
Subtotal1.700000100.00000000.611209
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped22.43500398.0000008.066158
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4578572.0000000.164615
Subtotal22.892860100.00000008.230773
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0660250.5000000.023738
Silver and its compoundsSilver, metal7440-22-40.1320501.0000000.047476
Tin and its compoundsTin, metal7440-31-513.00692598.5000004.676438
Subtotal13.205000100.00000004.747653
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-813.78160299.9900004.954961
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0013780.0100000.000495
Subtotal13.782980100.00000004.955457
Copper PlatingCopper and its compoundsCopper, metal7440-50-89.29750099.9800003.342772
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0018600.0200000.000669
Subtotal9.299360100.00000003.343441
Gold PlatingGold and its compoundsGold, metal7440-57-50.20537099.9900000.073837
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000210.0100000.000007
Subtotal0.205390100.00000000.073845
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002840.0300000.000102
Nickel and its compoundsNickel, metal7440-02-00.94800599.9700000.340841
Subtotal0.948290100.00000000.340943
Solder MaskBarium and its compoundsBarium sulfate7727-43-72.76079629.1000000.992601
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0569240.6000000.020466
Magnesium and its compoundsTalc14807-96-60.2846183.0000000.102330
Organic compoundsOther organic compounds.0.3415423.6000000.122796
PolymersPlastic: EP - Epoxide, Epoxy1.85950519.6000000.668556
PolymersPlastic: PAK4.18388644.1000001.504251
Subtotal9.487270100.00000003.411001
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-33.19254732.0000001.147831
Inorganic Silicon compoundsSilica, vitreous60676-86-00.5986036.0000000.215218
PolymersPlastic: PI - Polyimide6.18556062.0000002.223922
Subtotal9.976710100.00000003.586972
Total278.137416100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MKL82Z128VMC7
Product content declaration of MKL82Z128VMC7
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 02:11:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MKL82Z128VMC7Last Revision (GMT):
Tuesday, 05 March 2024, 02:11:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Test Report
2 Oct 2023
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.