MMA2301KEG

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMA2301KEGLast Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMA2301KEGSOT1761-1SO16607.174989 mg NoNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 102 335742023-11-246Not ApplicableNot ApplicableNot Applicable3 / 168 hours25030 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Au 1Bonding Wire - AuGold and its compoundsGold, metal7440-57-51.09987699.9900000.181146
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001100.0100000.000018
Subtotal1.099986100.00000000.181165
Bonding Wire - Au 2Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.27497599.9900000.045288
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000280.0100000.000005
Subtotal0.275003100.00000000.045292
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8152.08626497.29100025.048177
Iron and its compoundsIron, metal7439-89-63.7048082.3700000.610171
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0265750.0170000.004377
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2594930.1660000.042738
Tin and its compoundsTin, metal7440-31-50.0468960.0300000.007724
Zinc and its compoundsZinc, metal7440-66-60.1969640.1260000.032440
Subtotal156.321000100.000000025.745626
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001580.0100000.000026
Silver and its compoundsSilver, metal7440-22-41.57884299.9900000.260031
Subtotal1.579000100.00000000.260057
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-410.2825002.5000001.693499
Epoxy ResinsProprietary Material-Other Epoxy resins24.6780006.0000004.064397
Inorganic Silicon compoundsSilica, vitreous60676-86-0361.94400088.00000059.611151
Inorganic compoundsCarbon Black1333-86-42.0565000.5000000.338700
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.3390003.0000002.032198
Subtotal411.300000100.000000067.739944
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.26000020.0000000.042821
Silver and its compoundsSilver, metal7440-22-41.04000080.0000000.171285
Subtotal1.300000100.00000000.214106
Epoxy Adhesive 2Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.1440003.0000000.023716
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-91.20000025.0000000.197637
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-11.20000025.0000000.197637
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.25600047.0000000.371557
Subtotal4.800000100.00000000.790546
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0015400.0200000.000254
Tin and its compoundsTin, metal7440-31-57.69846099.9800001.267915
Subtotal7.700000100.00000001.268168
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped8.33000098.0000001.371927
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1700002.0000000.027998
Subtotal8.500000100.00000001.399926
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-38.58088098.0000001.413247
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1751202.0000000.028842
Subtotal8.756000100.00000001.442088
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0004401.0000000.000073
Boron and its compoundsBoron oxide1303-86-20.0035208.0000000.000580
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0013203.0000000.000217
Lead and its compoundsLead monooxide1317-36-80.02354053.5000000.003877
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.01518034.5000000.002500
Subtotal0.044000100.00000000.007247
Semiconductor Die CoatingSemiconductor Die CoatingInorganic Silicon compoundsSilica, vitreous60676-86-01.39180825.3056000.229227
Organic Silicon compoundsOther organic Silicon Compounds0.5171549.4028000.085174
PolymersPlastic: SI - Silicone Rubber3.59103865.2916000.591434
Subtotal5.500000100.00000000.905834
Total607.174989100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMA2301KEG
Product content declaration of MMA2301KEG
上次修订 Last Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au 1
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-金
Bonding Wire - Au 2
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
半导体芯片层
Semiconductor Die Coating
半导体芯片层
Semiconductor Die Coating
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMA2301KEGLast Revision (GMT):
Monday, 04 March 2024, 02:26:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Bonding Wire - Au 2Not AvailableNot AvailableNot AvailableNot Available
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 1Test Report
17 Jun 2019
Test Report
17 Jun 2019
Test Report
17 Jun 2019
Test Report
17 Jun 2019
Epoxy Adhesive 2Test Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2CAP DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
LEAD GLASS FRIT DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die CoatingTest Report
18 Jun 2020
Test Report
18 Jun 2020
Test Report
18 Jun 2020
Test Report
18 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.