MMA8652FCR1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMA8652FCR1Last Revision (GMT):
Monday, 25 September 2023, 10:07:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMA8652FCR1SOT1615-2VSON1014.113139 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 106 421152023-11-2413Not ApplicableNot ApplicableNot Applicable1 / Unlimited26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.04164896.5429000.295098
Gold and its compoundsGold, metal7440-57-50.0001510.3507000.001072
Palladium and its compoundsPalladium, metal7440-05-30.0013403.1064000.009495
Subtotal0.043139100.00000000.305666
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-83.04598796.20000021.582635
Inorganic Silicon compoundsSilicon7440-21-30.0205810.6500000.145829
Magnesium and its compoundsMagnesium, metal7439-95-40.0047500.1500000.033653
Nickel and its compoundsNickel, metal7440-02-00.0949893.0000000.673055
Subtotal3.166307100.000000022.435172
Gold PlatingGold and its compoundsGold, metal7440-57-50.00099999.9000000.007078
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.1000000.000007
Subtotal0.001000100.00000000.007086
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000410.1000000.000291
Nickel and its compoundsNickel, metal7440-02-00.04104799.9000000.290842
Subtotal0.041088100.00000000.291133
Palladium PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.1000000.000011
Palladium and its compoundsPalladium, metal7440-05-30.00160399.9000000.011361
Subtotal0.001605100.00000000.011372
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.1162502.5000000.823700
Inorganic Silicon compoundsSilica, vitreous60676-86-03.72000080.00000026.358417
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4417509.5000003.130062
Inorganic compoundsCarbon Black1333-86-40.0232500.5000000.164740
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.3487507.5000002.471102
Subtotal4.650000100.000000032.948021
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsCycloaliphatic Epoxy Resin244772-00-70.0177505.0000000.125769
Inorganic Silicon compoundsSilicon dioxide7631-86-90.21300060.0000001.509232
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.0177505.0000000.125769
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0177505.0000000.125769
PolymersPlastic: EP - Epoxide, Epoxy0.08875025.0000000.628847
Subtotal0.355000100.00000002.515386
Epoxy Adhesive 2Epoxy AdhesiveAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.0088752.5000000.062885
Aromatic amines and their salts4,4'-Diaminodiphenylsulfone80-08-00.0088752.5000000.062885
Epoxy ResinsFormaldehyde, cresol, epichlorohydrin polymer37382-79-90.08875025.0000000.628847
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0088752.5000000.062885
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.0088752.5000000.062885
Polymers2-Propenenitrile, polymer with 1,3-butadiene, carboxy-terminated, polymers with bisphenol A and epichlorohydrin68610-41-30.23075065.0000001.635001
Subtotal0.355000100.00000002.515387
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-32.74400098.00000019.442875
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0560002.0000000.396793
Subtotal2.800000100.000000019.839669
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-32.63277098.00000018.654744
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0537302.0000000.380709
Subtotal2.686500100.000000019.035453
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0001351.0000000.000957
Boron and its compoundsBoron oxide1303-86-20.0010808.0000000.007652
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0004053.0000000.002870
Lead and its compoundsLead monooxide1317-36-80.00722253.5000000.051176
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.00465834.5000000.033001
Subtotal0.013500100.00000000.095656
Total14.113139100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMA8652FCR1
Product content declaration of MMA8652FCR1
上次修订 Last Revision (GMT):
Monday, 25 September 2023, 10:07:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMA8652FCR1Last Revision (GMT):
Monday, 25 September 2023, 10:07:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
C7025Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
NI PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
PD PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die EncapsulantTest Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Epoxy Adhesive 1Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 2Test Report
26 Sep 2023
Test Report
26 Sep 2023
Test Report
26 Sep 2023
Test Report
26 Sep 2023
Semiconductor Die 1Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
11 Nov 2022
Semiconductor Die 2CAP DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
LEAD GLASS FRIT DIETest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.