MMRF1308HR5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMRF1308HR5Last Revision (GMT):
Wednesday, 28 September 2022, 06:34:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMRF1308HR5SOT1787-1CFM4F2928.073075 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 235 641782023-11-244NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-53.10677298.8450000.106103
Inorganic Silicon compoundsSilicon7440-21-30.0361451.1500000.001234
Nickel and its compoundsNickel, metal7440-02-00.0001570.0050000.000005
Subtotal3.143075100.00000000.107343
CapCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11684.63238496.00000057.533823
Inorganic Silicon compoundsSilicon dioxide7631-86-952.6447623.0000001.797932
Inorganic compoundsOther inorganic compounds17.5482541.0000000.599311
Subtotal1754.825400100.000000059.931066
EpoxyInorganic Silicon compoundsSilicon dioxide7631-86-917.76357045.0000000.606664
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-221.71103055.0000000.741478
Subtotal39.474600100.00000001.348143
Header Assembly/FlangeCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-135.45369489.4000001.210820
Chromium and Chromium III compoundsDichromium trioxide1308-38-92.3794436.0000000.081263
Inorganic Silicon compoundsSilicon dioxide7631-86-91.1897213.0000000.040632
Inorganic compoundsOther inorganic compounds0.6345181.6000000.021670
Subtotal39.657376100.00000001.354385
ConductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11.01577018.4000000.034691
Inorganic compoundsOther inorganic compounds0.0828071.5000000.002828
Molybdenum and its compoundsMolybdenum, metal7439-98-70.1380122.5000000.004713
Tungsten and its compoundsTungsten, metal7440-33-74.28389877.6000000.146304
Subtotal5.520487100.00000000.188536
FlangeCopper and its compoundsCopper, metal7440-50-8529.14498851.80000018.071441
Molybdenum and its compoundsMolybdenum, metal7439-98-7492.37043348.20000016.815510
Subtotal1021.515421100.000000034.886951
Gold PlatingGold and its compoundsGold, metal7440-57-52.47856199.9990000.084648
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000250.0010000.000001
Subtotal2.478586100.00000000.084649
Iron AlloyIron and its compoundsIron, metal7439-89-620.19146358.0000000.689582
Nickel and its compoundsNickel, metal7440-02-014.62140442.0000000.499352
Subtotal34.812867100.00000001.188934
Metal BrazeCopper and its compoundsCopper, metal7440-50-83.21765528.0000000.109890
Silver and its compoundsSilver, metal7440-22-48.27397172.0000000.282574
Subtotal11.491626100.00000000.392464
Nickel Cobalt PlatingCobalt and its compoundsCobalt, metal7440-48-43.14329830.0000000.107350
Nickel and its compoundsNickel, metal7440-02-07.33436170.0000000.250484
Subtotal10.477659100.00000000.357835
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0006760.1000000.000023
Palladium and its compoundsPalladium, metal7440-05-30.67530299.9000000.023063
Subtotal0.675978100.00000000.023086
Semiconductor DieSemiconductor DieGold and its compoundsGold, metal7440-57-50.0408001.0200000.001393
Inorganic Silicon compoundsSilicon, doped3.88001697.0004000.132511
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0791841.9796000.002704
Subtotal4.000000100.00000000.136609
Total2928.073075100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMRF1308HR5
Product content declaration of MMRF1308HR5
上次修订 Last Revision (GMT):
Wednesday, 28 September 2022, 06:34:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
陶瓷的
Ceramic
OOOOOO

环氧胶
Epoxy
OOOOOO
封装焊头/法兰
Header Assembly/Flange
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

法兰盘
Flange
OOOOOO

镀金材料
Gold Plating
OOOOOO

铁合金
Iron Alloy
OOOOOO

金属钎焊
Metal Braze
OOOOOO

镍钴电镀
Nickel Cobalt Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMRF1308HR5Last Revision (GMT):
Wednesday, 28 September 2022, 06:34:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Not Available
EPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
27 Jun 2019
Not Available
Header Assembly/FlangeAGCU SOLDERTest Report
23 Apr 2021
Test Report
23 Apr 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
ALLOY 42Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
Test Report
7 Jun 2021
AU PLATINGTest Report
2 Aug 2021
Test Report
30 Nov 2021
Test Report
30 Nov 2021
Test Report
25 Apr 2018
CERAMICTest Report
13 Sep 2021
Test Report
13 Sep 2021
Test Report
13 Sep 2021
Test Report
13 Sep 2021
CPC BOARDTest Report
18 Mar 2021
Test Report
18 Mar 2021
Test Report
18 Mar 2021
Not Available
ELECTRIC CONDUCTOR (TUNGSTEN)Test Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
Test Report
3 Sep 2021
NICO PLATINGTest Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
Test Report
21 Sep 2021
PD PLATINGTest Report
18 Jan 2021
Test Report
18 Jan 2021
Not AvailableNot Available
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.