MMW9002KCZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMW9002KCZLast Revision (GMT):
Wednesday, 21 July 2021, 07:35:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMW9002KCZSOT1914-1WLCSP5611.184280 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 450 060192020-10-15131 / Unlimited26030 sec.1 / Unlimited24020 sec.3NA
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-38.34242898.00000074.590658
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1702542.0000001.522258
Subtotal8.512682100.000000076.112916
Polyimide Coating 1Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0004400.5000000.003939
PolymersPlastic: PI - Polyimide0.08765899.5000000.783763
Subtotal0.088099100.00000000.787702
Polyimide Coating 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003900.5000000.003487
PolymersPlastic: PI - Polyimide0.07760799.5000000.693890
Subtotal0.077997100.00000000.697377
Redistribution MetalCopper and its compoundsCopper, metal7440-50-80.08855398.5352000.791767
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000050.0050000.000040
Titanium and its compoundsTitanium, metal7440-32-60.0013121.4598000.011730
Subtotal0.089870100.00000000.803538
Solder BallAluminum and its compoundsAluminum, metal7429-90-50.0000460.0020000.000411
Antimony and its compoundsAntimony, metal7440-36-00.0011480.0500000.010264
Arsenic and its compoundsArsenic, metal7440-38-20.0002300.0100000.002053
Bismuth and its compoundsBismuth, metal7440-69-90.0803583.5000000.718492
Cobalt and its compoundsCobalt, metal7440-48-40.0001150.0050000.001026
Copper and its compoundsCopper, metal7440-50-80.0114800.5000000.102642
Germanium and its compoundsGermanium7440-56-40.0001610.0070000.001437
Gold and its compoundsGold, metal7440-57-50.0001150.0050000.001026
Indium and its compoundsIndium, metal7440-74-60.0002300.0100000.002053
Inorganic compoundsSulfur7704-34-90.0000230.0010000.000205
Iron and its compoundsIron, metal7439-89-60.0003440.0150000.003079
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0011480.0500000.010264
Nickel and its compoundsNickel, metal7440-02-00.0011480.0500000.010264
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0000230.0010000.000205
Silver and its compoundsSilver, metal7440-22-40.0918384.0000000.821134
Tin and its compoundsTin, metal7440-31-52.10749791.79200018.843386
Zinc and its compoundsZinc, metal7440-66-60.0000460.0020000.000411
Subtotal2.295949100.000000020.528353
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.11890499.3483001.063140
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0050000.000053
Titanium and its compoundsTitanium, metal7440-32-60.0007740.6467000.006920
Subtotal0.119684100.00000001.070114
Total11.184280100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMW9002KCZ
Product content declaration of MMW9002KCZ
上次修订 Last Revision (GMT):
Wednesday, 21 July 2021, 07:35:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

聚酰亚胺涂料
Polyimide Coating 1
OOOOOO

聚酰亚胺涂料
Polyimide Coating 2
OOOOOO

电气再分配
Redistribution Metal
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMW9002KCZLast Revision (GMT):
Wednesday, 21 July 2021, 07:35:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.