MPC5566MZP144

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC5566MZP144Last Revision (GMT):
Tuesday, 10 August 2021, 06:43:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC5566MZP144SOT1705-1BGA4163170.012028 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 254 645572020-06-103Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-56.79734899.9900000.214427
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006800.0100000.000021
Subtotal6.798028100.00000000.214448
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-536.5024433.0895001.151492
Arsenic and its compoundsArsenic, metal7440-38-20.0118150.0010000.000373
Cadmium and its compoundsCadmium, metal7440-43-90.0118150.0010000.000373
Epoxy ResinsProprietary Material-Other Epoxy resins36.5024433.0895001.151492
Inorganic Silicon compoundsSilica, vitreous60676-86-01034.23665887.53590032.625638
Inorganic compoundsCarbon Black1333-86-43.6508350.3090000.115168
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0118150.0010000.000373
Organic Phosphorus compoundsOther organic phosphorous compounds3.6508350.3090000.115168
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins66.9213415.6641002.111075
Subtotal1181.500000100.000000037.271152
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1470470.8451000.004639
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.25467512.9579000.071125
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1470470.8451000.004639
Silver and its compoundsSilver, metal7440-22-414.85123185.3519000.468491
Subtotal17.400000100.00000000.548894
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.11100098.0000001.296872
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8390002.0000000.026467
Subtotal41.950000100.00000001.323339
Solder Ball - Low LeadSolder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1149.38704036.0000004.712507
Silver and its compoundsSilver, metal7440-22-48.2992802.0000000.261806
Tin and its compoundsTin, metal7440-31-5257.27768062.0000008.115984
Subtotal414.964000100.000000013.090297
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8561.91098399.98000017.725831
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1124050.0200000.003546
Subtotal562.023388100.000000017.729377
Copper PlatingCopper and its compoundsCopper, metal7440-50-8589.90250499.98000018.608841
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1180040.0200000.003723
Subtotal590.020508100.000000018.612564
Gold PlatingGold and its compoundsGold, metal7440-57-51.91764399.9900000.060493
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001920.0100000.000006
Subtotal1.917835100.00000000.060499
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036480.0300000.000115
Nickel and its compoundsNickel, metal7440-02-012.15674499.9700000.383492
Subtotal12.160392100.00000000.383607
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.96626829.1000000.282847
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1848710.6000000.005832
Magnesium and its compoundsTalc14807-96-60.9243583.0000000.029159
Organic compoundsOther organic compounds.1.1092293.6000000.034991
PolymersPlastic: EP - Epoxide, Epoxy6.03913619.6000000.190508
PolymersPlastic: PAK13.58805644.1000000.428644
Subtotal30.811919100.00000000.971981
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-346.28431546.6666001.460064
Inorganic Silicon compoundsSilica, vitreous60676-86-06.6120736.6667000.208582
PolymersPlastic: PI - Polyimide46.28431546.6667001.460068
Subtotal99.180604100.00000003.128714
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-378.17558137.0000002.466097
Inorganic Silicon compoundsSilica, vitreous60676-86-033.80565716.0000001.066420
PolymersPlastic: PI - Polyimide99.30411647.0000003.132610
Subtotal211.285354100.00000006.665128
Total3170.012028100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC5566MZP144
Product content declaration of MPC5566MZP144
上次修订 Last Revision (GMT):
Tuesday, 10 August 2021, 06:43:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC5566MZP144Last Revision (GMT):
Tuesday, 10 August 2021, 06:43:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Die EncapsulantTest Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Low LeadTest Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
28 Aug 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAU PLATINGTest Report
19 Jun 2020
Test Report
19 Jun 2020
Test Report
19 Jun 2020
Test Report
19 Jun 2020
AUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
COPPER FOILTest Report
4 May 2020
Test Report
4 May 2020
Test Report
4 May 2020
Test Report
4 May 2020
E679FG, GEA679FGNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGTest Report
9 Jun 2020
Test Report
9 Jun 2020
Test Report
9 Jun 2020
Test Report
9 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.