MPC8245TVV266D

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8245TVV266DLast Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8245TVV266DSOT1751-1LBGA3529163.843695 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 167 155572023-11-24123 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-518.79781599.9900000.205130
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0018800.0100000.000021
Subtotal18.799695100.00000000.205151
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins16.3500005.0000000.178419
Inorganic Silicon compoundsSilica, vitreous60676-86-0219.09000067.0000002.390809
Inorganic Silicon compoundsSilicon dioxide7631-86-981.75000025.0000000.892093
Inorganic compoundsCarbon Black1333-86-41.6350000.5000000.017842
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins8.1750002.5000000.089209
Subtotal327.000000100.00000003.568372
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.62800012.0000000.028678
Epoxy ResinsProprietary Material-Other Epoxy resins1.5330007.0000000.016729
Silver and its compoundsSilver, metal7440-22-417.73900081.0000000.193576
Subtotal21.900000100.00000000.238983
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped49.00000098.0000000.534710
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0000002.0000000.010913
Subtotal50.000000100.00000000.545623
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0060680.0010000.000066
Arsenic and its compoundsArsenic, metal7440-38-20.0060680.0010000.000066
Bismuth and its compoundsBismuth, metal7440-69-90.0060680.0010000.000066
Copper and its compoundsCopper, metal7440-50-84.2479080.7000000.046355
Iron and its compoundsIron, metal7439-89-60.0109230.0018000.000119
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0339830.0056000.000371
Silver and its compoundsSilver, metal7440-22-422.8173343.7600000.248993
Tin and its compoundsTin, metal7440-31-5579.71564695.5296006.326119
Subtotal606.844000100.00000006.622156
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum, metal7429-90-540.4279030.4967000.441167
Barium and its compoundsBarium7440-39-33.2638590.0401000.035617
Copper and its compoundsCopper, metal7440-50-88080.63192699.27920088.179504
Gold and its compoundsGold, metal7440-57-56.3323750.0778000.069102
Nickel and its compoundsNickel, metal7440-02-08.1393000.1000000.088820
Organic Silicon compoundsProprietary Material-Other organic silicon compounds0.4232440.0052000.004619
Zinc and its compoundsZinc, metal7440-66-60.0813930.0010000.000888
Subtotal8139.300000100.000000088.819716
Total9163.843695100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8245TVV266D
Product content declaration of MPC8245TVV266D
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8245TVV266DLast Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - SAC, Lead FreeTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.