MPC8245TZU300D

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8245TZU300DLast Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8245TZU300DSOT1751-1LBGA3529336.777410 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 167 185572023-11-2412Not ApplicableNot ApplicableNot Applicable3 / 168 hours22030 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.233432
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.012968
Tin and its compoundsTin, metal7440-31-537.53586362.0000000.402022
Subtotal60.541715100.00000000.648422
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-518.79781599.9900000.201331
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0018800.0100000.000020
Subtotal18.799695100.00000000.201351
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins16.3500005.0000000.175114
Inorganic Silicon compoundsSilica, vitreous60676-86-0219.09000067.0000002.346527
Inorganic Silicon compoundsSilicon dioxide7631-86-981.75000025.0000000.875570
Inorganic compoundsCarbon Black1333-86-41.6350000.5000000.017511
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins8.1750002.5000000.087557
Subtotal327.000000100.00000003.502279
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.62800012.0000000.028147
Epoxy ResinsProprietary Material-Other Epoxy resins1.5330007.0000000.016419
Silver and its compoundsSilver, metal7440-22-417.73900081.0000000.189991
Subtotal21.900000100.00000000.234556
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped49.00000098.0000000.524806
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0000002.0000000.010710
Subtotal50.000000100.00000000.535517
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0071920.0010000.000077
Antimony and its compoundsAntimony, metal7440-36-00.0071920.0010000.000077
Arsenic and its compoundsArsenic, metal7440-38-20.0143850.0020000.000154
Bismuth and its compoundsBismuth, metal7440-69-90.0079120.0011000.000085
Copper and its compoundsCopper, metal7440-50-80.0071920.0010000.000077
Iron and its compoundsIron, metal7439-89-60.0122270.0017000.000131
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1258.93574836.0015002.773288
Nickel and its compoundsNickel, metal7440-02-00.0266120.0037000.000285
Silver and its compoundsSilver, metal7440-22-414.3257431.9918000.153434
Tin and its compoundsTin, metal7440-31-5445.88460461.9942004.775573
Zinc and its compoundsZinc, metal7440-66-60.0071920.0010000.000077
Subtotal719.236000100.00000007.703257
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum, metal7429-90-540.4279030.4967000.432996
Barium and its compoundsBarium7440-39-33.2638590.0401000.034957
Copper and its compoundsCopper, metal7440-50-88080.63192699.27920086.546263
Gold and its compoundsGold, metal7440-57-56.3323750.0778000.067822
Nickel and its compoundsNickel, metal7440-02-08.1393000.1000000.087175
Organic Silicon compoundsProprietary Material-Other organic silicon compounds0.4232440.0052000.004533
Zinc and its compoundsZinc, metal7440-66-60.0813930.0010000.000872
Subtotal8139.300000100.000000087.174617
Total9336.777410100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8245TZU300D
Product content declaration of MPC8245TZU300D
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8245TZU300DLast Revision (GMT):
Tuesday, 05 March 2024, 02:28:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.