MPC8250AZUPIBC

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8250AZUPIBCLast Revision (GMT):
Thursday, 07 March 2024, 06:25:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8250AZUPIBCSOT1752LBGA48010196.956016 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 227 255572024-02-0611Not ApplicableNot ApplicableNot Applicable3 / 168 hours22030 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.213740
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.011874
Tin and its compoundsTin, metal7440-31-537.53586362.0000000.368109
Subtotal60.541715100.00000000.593723
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-524.99709199.9900000.245143
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0025000.0100000.000024
Subtotal24.999591100.00000000.245167
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.2700005.0000000.139944
Inorganic Silicon compoundsSilica, vitreous60676-86-0191.21800067.0000001.875246
Inorganic Silicon compoundsSilicon dioxide7631-86-971.35000025.0000000.699719
Inorganic compoundsCarbon Black1333-86-41.4270000.5000000.013994
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.1350002.5000000.069972
Subtotal285.400000100.00000002.798875
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.48000012.0000000.034128
Epoxy ResinsProprietary Material-Other Epoxy resins2.0300007.0000000.019908
Silver and its compoundsSilver, metal7440-22-423.49000081.0000000.230363
Subtotal29.000000100.00000000.284399
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped58.71641698.0000000.575823
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.1982942.0000000.011751
Subtotal59.914710100.00000000.587574
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0091880.0010000.000090
Antimony and its compoundsAntimony, metal7440-36-00.0091880.0010000.000090
Arsenic and its compoundsArsenic, metal7440-38-20.0183760.0020000.000180
Bismuth and its compoundsBismuth, metal7440-69-90.0101070.0011000.000099
Copper and its compoundsCopper, metal7440-50-80.0091880.0010000.000090
Iron and its compoundsIron, metal7439-89-60.0156200.0017000.000153
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1330.78178236.0015003.243927
Nickel and its compoundsNickel, metal7440-02-00.0339960.0037000.000333
Silver and its compoundsSilver, metal7440-22-418.3006581.9918000.179472
Tin and its compoundsTin, metal7440-31-5569.60271061.9942005.586007
Zinc and its compoundsZinc, metal7440-66-60.0091880.0010000.000090
Subtotal918.800000100.00000009.010532
Substrate, Pre-plated NiAuCopper PlatingCopper and its compoundsCopper, metal7440-50-81969.51439599.00000019.314729
Nickel and its compoundsNickel, metal7440-02-019.8940851.0000000.195098
Subtotal1989.408480100.000000019.509827
EpoxyInorganic Silicon compoundsSilica, vitreous60676-86-01072.25113637.06000010.515404
PolymersPlastic: EP - Epoxide, Epoxy1821.03309462.94000017.858595
Subtotal2893.284230100.000000028.373999
Gold PlatingGold and its compoundsGold, metal7440-57-567.00567699.9800000.657115
Nickel and its compoundsNickel, metal7440-02-00.0134040.0200000.000131
Subtotal67.019080100.00000000.657246
Nickel PlatingInorganic compoundsSodium7440-23-53.6860491.0000000.036149
Nickel and its compoundsNickel, metal7440-02-0364.91889199.0000003.578704
Subtotal368.604940100.00000003.614853
Solder MaskAromatic hydrocarbon compoundsPigment Green 461725-50-61.4770650.5000000.014485
Barium and its compoundsBarium sulfate7727-43-751.40187117.4000000.504090
Inorganic Silicon compoundsSilicon dioxide7631-86-98.8623913.0000000.086912
PolymersPlastic: E/P - Ethylene/Propylene70.60371923.9000000.692400
PolymersPlastic: PAK163.06800455.2000001.599183
Subtotal295.413050100.00000002.897071
Substrate CoreInorganic Silicon compoundsSilicon dioxide7631-86-918.9069640.5900000.185418
PolymersPlastic: PI - Polyimide3185.66325699.41000031.241316
Subtotal3204.570220100.000000031.426734
Total10196.956016100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8250AZUPIBC
Product content declaration of MPC8250AZUPIBC
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 06:25:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
镀铜
Copper Plating
OOOOOO

环氧胶
Epoxy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8250AZUPIBCLast Revision (GMT):
Thursday, 07 March 2024, 06:25:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuADHESIVENot AvailableNot AvailableNot AvailableNot Available
AU PLATINGNot AvailableNot AvailableNot AvailableNot Available
CORENot AvailableNot AvailableNot AvailableNot Available
CU FOILNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGNot AvailableNot AvailableNot AvailableNot Available
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.