MPC8306SVMAFDCA

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8306SVMAFDCALast Revision (GMT):
Wednesday, 29 March 2023, 02:15:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8306SVMAFDCASOT1530-1LFBGA3691038.209676 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 216 415572023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-810.07726098.7998000.970638
Palladium and its compoundsPalladium, metal7440-05-30.1224161.2002000.011791
Subtotal10.199676100.00000000.982429
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins13.7050005.0000001.320061
Inorganic Silicon compoundsSilica, vitreous60676-86-0183.64700067.00000017.688816
Inorganic Silicon compoundsSilicon dioxide7631-86-968.52500025.0000006.600305
Inorganic compoundsCarbon Black1333-86-41.3705000.5000000.132006
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.8525002.5000000.660030
Subtotal274.100000100.000000026.401218
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-95.67000045.0000000.546133
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0012600.0100000.000121
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.6300005.0000000.060681
PolymersPlastic: EP - Epoxide, Epoxy6.29874049.9900000.606692
Subtotal12.600000100.00000001.213628
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-318.62000098.0000001.793472
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3800002.0000000.036602
Subtotal19.000000100.00000001.830073
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0030690.0032000.000296
Antimony and its compoundsAntimony, metal7440-36-00.0119890.0125000.001155
Arsenic and its compoundsArsenic, metal7440-38-20.0071930.0075000.000693
Bismuth and its compoundsBismuth, metal7440-69-90.0180310.0188000.001737
Cadmium and its compoundsCadmium, metal7440-43-90.0012470.0013000.000120
Copper and its compoundsCopper, metal7440-50-80.0060420.0063000.000582
Gold and its compoundsGold, metal7440-57-50.0060420.0063000.000582
Indium and its compoundsIndium, metal7440-74-60.0060420.0063000.000582
Inorganic compoundsSulfur7704-34-90.0009590.0010000.000092
Iron and its compoundsIron, metal7439-89-60.0119890.0125000.001155
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0300200.0313000.002891
Nickel and its compoundsNickel, metal7440-02-00.0030690.0032000.000296
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0060420.0063000.000582
Silver and its compoundsSilver, metal7440-22-43.3570423.5002000.323349
Tin and its compoundsTin, metal7440-31-592.43940196.3814008.903731
Zinc and its compoundsZinc, metal7440-66-60.0018220.0019000.000176
Subtotal95.910000100.00000009.238018
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8200.86639199.99000019.347382
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0200890.0100000.001935
Subtotal200.886480100.000000019.349317
Copper PlatingCopper and its compoundsCopper, metal7440-50-8201.03418599.98000019.363544
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0402150.0200000.003874
Subtotal201.074400100.000000019.367417
Gold PlatingGold and its compoundsGold, metal7440-57-51.50321099.9900000.144789
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001500.0100000.000015
Subtotal1.503360100.00000000.144803
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0028560.0300000.000275
Nickel and its compoundsNickel, metal7440-02-09.51842499.9700000.916811
Subtotal9.521280100.00000000.917086
Solder MaskBarium and its compoundsBarium sulfate7727-43-722.80352829.1000002.196428
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4701760.6000000.045287
Magnesium and its compoundsTalc14807-96-62.3508793.0000000.226436
Organic compoundsOther organic compounds.2.8210553.6000000.271723
PolymersPlastic: EP - Epoxide, Epoxy15.35907719.6000001.479381
PolymersPlastic: PAK34.55792444.1000003.328607
Subtotal78.362640100.00000007.547863
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-314.55857646.6700001.402277
Inorganic Silicon compoundsSilica, vitreous60676-86-02.0775686.6600000.200111
PolymersPlastic: PI - Polyimide14.55857646.6700001.402277
Subtotal31.194720100.00000003.004665
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-338.42713437.0000003.701288
Inorganic Silicon compoundsSilica, vitreous60676-86-016.61713916.0000001.600557
PolymersPlastic: PI - Polyimide48.81284647.0000004.701637
Subtotal103.857120100.000000010.003482
Total1038.209676100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8306SVMAFDCA
Product content declaration of MPC8306SVMAFDCA
上次修订 Last Revision (GMT):
Wednesday, 29 March 2023, 02:15:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8306SVMAFDCALast Revision (GMT):
Wednesday, 29 March 2023, 02:15:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.