MPC8308CVMAFDA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MPC8308CVMAFDALast Revision (GMT):
Monday, 22 July 2024, 12:34:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8308CVMAFDASOT1523-2LFBGA4731604.070819 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 115 255572023-11-24143 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.09225598.7998000.192775
Palladium and its compoundsPalladium, metal7440-05-30.0375641.2002000.002342
Subtotal3.129819100.00000000.195117
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins25.8150005.0000001.609343
Inorganic Silicon compoundsSilica, vitreous60676-86-0345.92100067.00000021.565195
Inorganic Silicon compoundsSilicon dioxide7631-86-9129.07500025.0000008.046715
Inorganic compoundsCarbon Black1333-86-42.5815000.5000000.160934
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.9075002.5000000.804671
Subtotal516.300000100.000000032.186858
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.71000045.0000000.106604
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0003800.0100000.000024
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1900005.0000000.011845
PolymersPlastic: EP - Epoxide, Epoxy1.89962049.9900000.118425
Subtotal3.800000100.00000000.236897
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.42200098.0000001.460160
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4780002.0000000.029799
Subtotal23.900000100.00000001.489959
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0039340.0032000.000245
Antimony and its compoundsAntimony, metal7440-36-00.0153680.0125000.000958
Arsenic and its compoundsArsenic, metal7440-38-20.0092210.0075000.000575
Bismuth and its compoundsBismuth, metal7440-69-90.0231130.0188000.001441
Cadmium and its compoundsCadmium, metal7440-43-90.0015980.0013000.000100
Copper and its compoundsCopper, metal7440-50-80.0077450.0063000.000483
Gold and its compoundsGold, metal7440-57-50.0077450.0063000.000483
Indium and its compoundsIndium, metal7440-74-60.0077450.0063000.000483
Inorganic compoundsSulfur7704-34-90.0012290.0010000.000077
Iron and its compoundsIron, metal7439-89-60.0153680.0125000.000958
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0384810.0313000.002399
Nickel and its compoundsNickel, metal7440-02-00.0039340.0032000.000245
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0077450.0063000.000483
Silver and its compoundsSilver, metal7440-22-44.3031813.5002000.268266
Tin and its compoundsTin, metal7440-31-5118.49225796.3814007.386972
Zinc and its compoundsZinc, metal7440-66-60.0023360.0019000.000146
Subtotal122.941000100.00000007.664313
Substrate, Pre-plated NiAuCopper Foil 1Copper and its compoundsCopper, metal7440-50-8107.11908799.9900006.677952
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0107130.0100000.000668
Subtotal107.129800100.00000006.678620
Copper Foil 2Copper and its compoundsCopper, metal7440-50-8125.23687599.9900007.807441
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0125250.0100000.000781
Subtotal125.249400100.00000007.808221
Copper PlatingCopper and its compoundsCopper, metal7440-50-8184.82011699.99000011.521942
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0184840.0100000.001152
Subtotal184.838600100.000000011.523095
Gold PlatingGold and its compoundsGold, metal7440-57-514.00859999.9900000.873316
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014010.0100000.000087
Subtotal14.010000100.00000000.873403
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0134960.0100000.000841
Nickel and its compoundsNickel, metal7440-02-0134.94950499.9900008.412939
Subtotal134.963000100.00000008.413781
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0540790.1000000.003371
Barium and its compoundsBarium sulfate7727-43-715.73687329.1000000.981059
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3244720.6000000.020228
Magnesium and its compoundsTalc14807-96-61.6223583.0000000.101140
Organic compoundsOther organic compounds.1.9468303.6000000.121368
PolymersPlastic: EP - Epoxide, Epoxy10.54532719.5000000.657410
PolymersPlastic: PAK23.84866344.1000001.486759
Subtotal54.078600100.00000003.371335
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-341.90297632.0000002.612290
Inorganic Silicon compoundsSilica, vitreous60676-86-07.8568086.0000000.489804
PolymersPlastic: PI - Polyimide81.18701662.0000005.061311
Subtotal130.946800100.00000008.163405
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-367.63000637.0000004.216148
Inorganic Silicon compoundsSilica, vitreous60676-86-029.24540816.0000001.823199
PolymersPlastic: PI - Polyimide85.90838647.0000005.355648
Subtotal182.783800100.000000011.394996
Total1604.070819100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8308CVMAFDA
Product content declaration of MPC8308CVMAFDA
上次修订 Last Revision (GMT):
Monday, 22 July 2024, 12:34:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8308CVMAFDALast Revision (GMT):
Monday, 22 July 2024, 12:34:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
Test Report
12 May 2021
AUS308Not AvailableTest Report
10 Jul 2023
Test Report
10 Jul 2023
Test Report
10 Jul 2023
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
Test Report
25 Mar 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
Test Report
3 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.