MPC8309CVMADDCA

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NXP Semiconductors
Product content declaration of MPC8309CVMADDCALast Revision (GMT):
Monday, 03 April 2023, 05:14:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8309CVMADDCASOT1531-1LFBGA4891063.043009 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 230 615572023-11-24153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-83.79688598.7998000.357171
Palladium and its compoundsPalladium, metal7440-05-30.0461241.2002000.004339
Subtotal3.843009100.00000000.361510
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins13.7050005.0000001.289224
Inorganic Silicon compoundsSilica, vitreous60676-86-0183.64700067.00000017.275595
Inorganic Silicon compoundsSilicon dioxide7631-86-968.52500025.0000006.446117
Inorganic compoundsCarbon Black1333-86-41.3705000.5000000.128922
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins6.8525002.5000000.644612
Subtotal274.100000100.000000025.784469
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-95.67000045.0000000.533374
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0012600.0100000.000118
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.6300005.0000000.059264
PolymersPlastic: EP - Epoxide, Epoxy6.29874049.9900000.592520
Subtotal12.600000100.00000001.185277
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-318.62000098.0000001.751575
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3800002.0000000.035746
Subtotal19.000000100.00000001.787322
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0040670.0032000.000383
Antimony and its compoundsAntimony, metal7440-36-00.0158870.0125000.001494
Arsenic and its compoundsArsenic, metal7440-38-20.0095320.0075000.000897
Bismuth and its compoundsBismuth, metal7440-69-90.0238950.0188000.002248
Cadmium and its compoundsCadmium, metal7440-43-90.0016520.0013000.000155
Copper and its compoundsCopper, metal7440-50-80.0080070.0063000.000753
Gold and its compoundsGold, metal7440-57-50.0080070.0063000.000753
Indium and its compoundsIndium, metal7440-74-60.0080070.0063000.000753
Inorganic compoundsSulfur7704-34-90.0012710.0010000.000120
Iron and its compoundsIron, metal7439-89-60.0158870.0125000.001494
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0397820.0313000.003742
Nickel and its compoundsNickel, metal7440-02-00.0040670.0032000.000383
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0080070.0063000.000753
Silver and its compoundsSilver, metal7440-22-44.4487543.5002000.418492
Tin and its compoundsTin, metal7440-31-5122.50075996.38140011.523594
Zinc and its compoundsZinc, metal7440-66-60.0024150.0019000.000227
Subtotal127.100000100.000000011.956242
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8199.80161899.99000018.795253
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0199820.0100000.001880
Subtotal199.821600100.000000018.797132
Copper PlatingCopper and its compoundsCopper, metal7440-50-8205.04234399.98000019.288245
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0410170.0200000.003858
Subtotal205.083360100.000000019.292104
Gold PlatingGold and its compoundsGold, metal7440-57-52.00428099.9900000.188542
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002000.0100000.000019
Subtotal2.004480100.00000000.188561
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0037960.0300000.000357
Nickel and its compoundsNickel, metal7440-02-012.64948499.9700001.189931
Subtotal12.653280100.00000001.190289
Solder MaskBarium and its compoundsBarium sulfate7727-43-721.27235629.1000002.001081
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4386050.6000000.041259
Magnesium and its compoundsTalc14807-96-62.1930263.0000000.206297
Organic compoundsOther organic compounds.2.6316323.6000000.247557
PolymersPlastic: EP - Epoxide, Epoxy14.32777319.6000001.347807
PolymersPlastic: PAK32.23748844.1000003.032567
Subtotal73.100880100.00000006.876569
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-314.20776746.6700001.336518
Inorganic Silicon compoundsSilica, vitreous60676-86-02.0275066.6600000.190727
PolymersPlastic: PI - Polyimide14.20776746.6700001.336518
Subtotal30.443040100.00000002.863764
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-338.21854337.0000003.595202
Inorganic Silicon compoundsSilica, vitreous60676-86-016.52693816.0000001.554682
PolymersPlastic: PI - Polyimide48.54787947.0000004.566878
Subtotal103.293360100.00000009.716762
Total1063.043009100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8309CVMADDCA
Product content declaration of MPC8309CVMADDCA
上次修订 Last Revision (GMT):
Monday, 03 April 2023, 05:14:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8309CVMADDCALast Revision (GMT):
Monday, 03 April 2023, 05:14:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Substrate, Pre-plated NiAuAUS308Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.