MPC850SRCVR50BU

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NXP Semiconductors
Product content declaration of MPC850SRCVR50BULast Revision (GMT):
Saturday, 10 September 2022, 09:46:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC850SRCVR50BUSOT1667-1BGA2561676.528986 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 167 595572020-01-173 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-88.03241498.1000000.479110
Gold and its compoundsGold, metal7440-57-50.0081880.1000000.000488
Palladium and its compoundsPalladium, metal7440-05-30.1473841.8000000.008791
Subtotal8.187986100.00000000.488389
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.9312673.0895001.427429
Arsenic and its compoundsArsenic, metal7440-38-20.0077460.0010000.000462
Cadmium and its compoundsCadmium, metal7440-43-90.0077460.0010000.000462
Epoxy ResinsProprietary Material-Other Epoxy resins23.9312673.0895001.427429
Inorganic Silicon compoundsSilica, vitreous60676-86-0678.05308187.53590040.443863
Inorganic compoundsCarbon Black1333-86-42.3935140.3090000.142766
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0077460.0010000.000462
Organic Phosphorus compoundsOther organic phosphorous compounds2.3935140.3090000.142766
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins43.8741195.6641002.616961
Subtotal774.600000100.000000046.202601
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.05200012.0000000.122396
Epoxy ResinsProprietary Material-Other Epoxy resins1.1970007.0000000.071398
Silver and its compoundsSilver, metal7440-22-413.85100081.0000000.826171
Subtotal17.100000100.00000001.019964
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped62.62200098.0000003.735217
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2780002.0000000.076229
Subtotal63.900000100.00000003.811446
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0044130.0010000.000263
Arsenic and its compoundsArsenic, metal7440-38-20.0044130.0010000.000263
Bismuth and its compoundsBismuth, metal7440-69-90.0044130.0010000.000263
Copper and its compoundsCopper, metal7440-50-83.0893870.7000000.184273
Iron and its compoundsIron, metal7439-89-60.0079440.0018000.000474
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0247150.0056000.001474
Silver and its compoundsSilver, metal7440-22-416.5944223.7600000.989808
Tin and its compoundsTin, metal7440-31-5421.61129295.52960025.147868
Subtotal441.341000100.000000026.324686
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-32.5689740.6917000.153232
Barium and its compoundsBarium sulfate7727-43-723.8397956.4189001.421973
Copper and its compoundsCopper, metal7440-50-865.92461417.7503003.932208
Epoxy ResinsProprietary Material-Other Non-halogenated Epoxy resins131.90233935.5149007.867585
Gold and its compoundsGold, metal7440-57-53.5082440.9446000.209256
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3112.30727530.2389006.698797
Inorganic Silicon compoundsSilicon7440-21-30.3082620.0830000.018387
Nickel and its compoundsNickel, metal7440-02-00.8300790.2235000.049512
PolymersOther acrylic resins30.2104198.1342001.801962
Subtotal371.400000100.000000022.152912
Total1676.528986100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC850SRCVR50BU
Product content declaration of MPC850SRCVR50BU
上次修订 Last Revision (GMT):
Saturday, 10 September 2022, 09:46:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC850SRCVR50BULast Revision (GMT):
Saturday, 10 September 2022, 09:46:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Semiconductor DieTest Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Solder Ball - SAC, Lead FreeTest Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.