MPC8567VTAQGG

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8567VTAQGGLast Revision (GMT):
Tuesday, 06 August 2024, 06:52:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8567VTAQGGSOT1618-1BGA10236234.724000 mg YesNoYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 141 945572024-02-068Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
CapacitorCapacitorBarium and its compoundsBarium titanate12047-27-749.89758465.4000000.800317
Copper and its compoundsCopper, metal7440-50-810.52884813.8000000.168874
Nickel and its compoundsNickel, metal7440-02-014.87772019.5000000.238627
Tin and its compoundsTin, metal7440-31-50.9918481.3000000.015908
Subtotal76.296000100.00000001.223727
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped309.44430089.1000004.963240
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.7076729.4177000.524605
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1257000.9000000.050134
Nickel and its compoundsNickel, metal7440-02-00.2865230.0825000.004596
Tin and its compoundsTin, metal7440-31-51.7212190.4956000.027607
Titanium and its compoundsTitanium, metal7440-32-60.0145870.0042000.000234
Subtotal347.300000100.00000005.570415
Solder Ball - Lead FreeSolder Ball - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.8161460.0951000.013090
Arsenic and its compoundsArsenic, metal7440-38-20.0746630.0087000.001197
Bismuth and its compoundsBismuth, metal7440-69-90.3432790.0400000.005506
Iron and its compoundsIron, metal7439-89-60.3003690.0350000.004818
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0197390.0023000.000317
Silver and its compoundsSilver, metal7440-22-430.0661093.5034000.482236
Tin and its compoundsTin, metal7440-31-5826.57769596.31550013.257647
Subtotal858.198000100.000000013.764811
Solder FluxSolder FluxAliphatic AminesOther aliphatic amines0.1121400.2100000.001799
Aluminum and its compoundsAluminum, metal7429-90-50.0005340.0010000.000009
Antimony and its compoundsAntimony, metal7440-36-00.0534000.1000000.000856
Arsenic and its compoundsArsenic, metal7440-38-20.0052870.0099000.000085
Bismuth and its compoundsBismuth, metal7440-69-90.0160200.0300000.000257
Cadmium and its compoundsCadmium, metal7440-43-90.0010680.0020000.000017
Copper and its compoundsCopper, metal7440-50-80.2611260.4890000.004188
Gold and its compoundsGold, metal7440-57-50.0026700.0050000.000043
Iron and its compoundsIron, metal7439-89-60.0106800.0200000.000171
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0267000.0500000.000428
Nickel and its compoundsNickel, metal7440-02-00.0053400.0100000.000086
Silver and its compoundsSilver, metal7440-22-41.4337902.6850000.022997
Tin and its compoundsTin, metal7440-31-551.45997896.3670000.825377
Zinc and its compoundsZinc, metal7440-66-60.0112670.0211000.000181
Subtotal53.400000100.00000000.856493
SubstrateSubstrateArsenic and its compoundsArsenic, metal7440-38-20.0772300.0016000.001239
Barium and its compoundsBarium sulfate7727-43-70.0482690.0010000.000774
Cobalt and its compoundsCobalt, metal7440-48-40.1882490.0039000.003019
Copper and its compoundsCopper, metal7440-50-81887.48684239.10350030.273783
Epoxy ResinsOther Epoxy resins1540.55340431.91600024.709248
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31230.57471325.49410019.737437
Lead and its compoundsLead, metallic lead and lead alloys7439-92-12.8285630.0586000.045368
Silver and its compoundsSilver, metal7440-22-44.8365540.1002000.077575
Tin and its compoundsTin, metal7440-31-5160.3061763.3211002.571183
Subtotal4826.900000100.000000077.419626
UnderfillUnderfillBismuth and its compoundsBismuth, metal7440-69-90.8716331.2001000.013980
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-514.52701720.0014000.233002
Inorganic Silicon compoundsSilica, vitreous60676-86-030.86775042.5000000.495094
Inorganic compoundsCarbon Black1333-86-40.7263731.0001000.011650
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-63.6317915.0004000.058251
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins22.00543730.2980000.352950
Subtotal72.630000100.00000001.164927
Total6234.724000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8567VTAQGG
Product content declaration of MPC8567VTAQGG
上次修订 Last Revision (GMT):
Tuesday, 06 August 2024, 06:52:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor
电容器
Capacitor
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8567VTAQGGLast Revision (GMT):
Tuesday, 06 August 2024, 06:52:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Semiconductor DieBUMPNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Solder FluxTest Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
SubstrateAUS 703Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
Test Report
11 Oct 2023
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
GX-3Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
PHP-900 IR-6Test Report
18 Mar 2024
Test Report
18 Mar 2024
Test Report
20 Apr 2023
Not Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.