MPC8569VJAUNLB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC8569VJAUNLBLast Revision (GMT):
Wednesday, 09 June 2021, 06:12:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8569VJAUNLBSOT1624-1BGA7833577.539000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 177 965572023-11-2493 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Capacitor 1CapacitorBarium and its compoundsBarium titanate12047-27-79.96672085.9200000.278591
Calcium and its compoundsCalcium monoxide1305-78-80.2064801.7800000.005772
Copper and its compoundsCuprous oxide1317-39-10.5417204.6700000.015142
Nickel and its compoundsNickel, metal7440-02-00.7238406.2400000.020233
Tin and its compoundsTin, metal7440-31-50.1612401.3900000.004507
Subtotal11.600000100.00000000.324245
Capacitor 2CapacitorBarium and its compoundsBarium titanate12047-27-71.13785785.8760000.031806
Calcium and its compoundsCalcium monoxide1305-78-80.0238341.7988000.000666
Copper and its compoundsCuprous oxide1317-39-10.0617934.6636000.001727
Nickel and its compoundsNickel, metal7440-02-00.0829786.2625000.002319
Tin and its compoundsTin, metal7440-31-50.0185381.3991000.000518
Subtotal1.325000100.00000000.037037
Capacitor 3CapacitorBarium and its compoundsBarium titanate12047-27-72.27571485.8760000.063611
Calcium and its compoundsCalcium monoxide1305-78-80.0476681.7988000.001332
Copper and its compoundsCuprous oxide1317-39-10.1235854.6636000.003455
Nickel and its compoundsNickel, metal7440-02-00.1659566.2625000.004639
Tin and its compoundsTin, metal7440-31-50.0370761.3991000.001036
Subtotal2.650000100.00000000.074073
Capacitor 4CapacitorBarium and its compoundsBarium titanate12047-27-721.61928385.8760000.604306
Calcium and its compoundsCalcium monoxide1305-78-80.4528481.7988000.012658
Copper and its compoundsCuprous oxide1317-39-11.1740614.6636000.032818
Nickel and its compoundsNickel, metal7440-02-01.5765846.2625000.044069
Tin and its compoundsTin, metal7440-31-50.3522231.3991000.009845
Subtotal25.175000100.00000000.703696
Capacitor 5CapacitorBarium and its compoundsBarium titanate12047-27-75.69087585.9000000.159072
Calcium and its compoundsCalcium monoxide1305-78-80.1192501.8000000.003333
Copper and its compoundsCuprous oxide1317-39-10.3080634.6500000.008611
Nickel and its compoundsNickel, metal7440-02-00.4140626.2500000.011574
Tin and its compoundsTin, metal7440-31-50.0927501.4000000.002593
Subtotal6.625000100.00000000.185183
Capacitor 6CapacitorBarium and its compoundsBarium titanate12047-27-759.76969685.8760001.670693
Calcium and its compoundsCalcium monoxide1305-78-81.2519651.7988000.034995
Copper and its compoundsCuprous oxide1317-39-13.2458664.6636000.090729
Nickel and its compoundsNickel, metal7440-02-04.3587006.2625000.121835
Tin and its compoundsTin, metal7440-31-50.9737741.3991000.027219
Subtotal69.600000100.00000001.945471
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-711.67200040.0000000.326258
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-64.37700015.0000000.122347
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-213.13100045.0000000.367040
Subtotal29.180000100.00000000.815644
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped195.05920089.6000005.452329
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9593000.9000000.054767
Nickel and its compoundsNickel, metal7440-02-01.0885000.5000000.030426
Silver and its compoundsSilver, metal7440-22-40.6857550.3150000.019168
Tin and its compoundsTin, metal7440-31-518.9072458.6850000.528499
Subtotal217.700000100.00000006.085189
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-83.2868260.5009000.091874
Silver and its compoundsSilver, metal7440-22-419.7209543.0054000.551244
Tin and its compoundsTin, metal7440-31-5633.17622096.49370017.698653
Subtotal656.184000100.000000018.341771
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-2382.65500015.30620010.696040
Arsenic and its compoundsArsenic, metal7440-38-20.0250000.0010000.000699
Barium and its compoundsBarium sulfate7727-43-710.2700000.4108000.287069
Copper and its compoundsCopper phthalocyanine147-14-81.6425000.0657000.045911
Copper and its compoundsCopper, metal7440-50-8895.52500035.82100025.031872
Epoxy ResinsBisphenol A diglycidyl ether1675-54-321.6575000.8663000.605374
Epoxy ResinsOther Epoxy resins209.1625008.3665005.846547
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3739.79500029.59180020.678880
Inorganic Silicon compoundsSilicon dioxide7631-86-9187.1350007.4854005.230830
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0250000.0010000.000699
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-635.4175001.4167000.989996
Silver and its compoundsSilver, metal7440-22-40.5025000.0201000.014046
Tin and its compoundsTin, metal7440-31-516.1875000.6475000.452476
Subtotal2500.000000100.000000069.880440
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-520.70000072.0000000.578610
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.5750002.0000000.016072
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.3000008.0000000.064290
Zinc and its compoundsZinc oxide1314-13-25.17500018.0000000.144652
Subtotal28.750000100.00000000.803625
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-017.25000060.0000000.482175
Inorganic compoundsCarbon Black1333-86-40.0287500.1000000.000804
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2587500.9000000.007233
PolymersPlastic: EP - Epoxide, Epoxy11.21250039.0000000.313414
Subtotal28.750000100.00000000.803625
Total3577.539000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC8569VJAUNLB
Product content declaration of MPC8569VJAUNLB
上次修订 Last Revision (GMT):
Wednesday, 09 June 2021, 06:12:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
电容器
Capacitor 1
电容器
Capacitor
OOOOOO
电容器
Capacitor 2
电容器
Capacitor
OOOOOO
电容器
Capacitor 3
电容器
Capacitor
OOOOOO
电容器
Capacitor 4
电容器
Capacitor
OOOOOO
电容器
Capacitor 5
电容器
Capacitor
OOOOOO
电容器
Capacitor 6
电容器
Capacitor
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC8569VJAUNLBLast Revision (GMT):
Wednesday, 09 June 2021, 06:12:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Capacitor 1Not AvailableNot AvailableNot AvailableNot Available
Capacitor 2Not AvailableNot AvailableNot AvailableNot Available
Capacitor 3Not AvailableNot AvailableNot AvailableNot Available
Capacitor 4Not AvailableNot AvailableNot AvailableNot Available
Capacitor 5Not AvailableNot AvailableNot AvailableNot Available
Capacitor 6Not AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.