MPC860TZQ50D4R2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC860TZQ50D4R2Last Revision (GMT):
Tuesday, 17 August 2021, 03:39:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC860TZQ50D4R2SOT1666BGA3572293.231701 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 167 955182020-09-298Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.950406
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.052800
Tin and its compoundsTin, metal7440-31-537.53586362.0000001.636811
Subtotal60.541715100.00000002.640017
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-88.01317297.8650000.349427
Gold and its compoundsGold, metal7440-57-50.0110540.1350000.000482
Palladium and its compoundsPalladium, metal7440-05-30.1637602.0000000.007141
Subtotal8.187986100.00000000.357050
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-524.1753383.0895001.054204
Arsenic and its compoundsArsenic, metal7440-38-20.0078250.0010000.000341
Cadmium and its compoundsCadmium, metal7440-43-90.0078250.0010000.000341
Epoxy ResinsProprietary Material-Other Epoxy resins24.1753383.0895001.054204
Inorganic Silicon compoundsSilica, vitreous60676-86-0684.96841787.53590029.869133
Inorganic compoundsCarbon Black1333-86-42.4179250.3090000.105437
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0078250.0010000.000341
Organic Phosphorus compoundsOther organic phosphorous compounds2.4179250.3090000.105437
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins44.3215825.6641001.932713
Subtotal782.500000100.000000034.122152
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.0557770.8451000.002432
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.85522112.9579000.037293
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0557770.8451000.002432
Silver and its compoundsSilver, metal7440-22-45.63322585.3519000.245646
Subtotal6.600000100.00000000.287803
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.60100098.0000001.814078
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8490002.0000000.037022
Subtotal42.450000100.00000001.851099
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0072940.0010000.000318
Antimony and its compoundsAntimony, metal7440-36-00.0072940.0010000.000318
Arsenic and its compoundsArsenic, metal7440-38-20.0145890.0020000.000636
Bismuth and its compoundsBismuth, metal7440-69-90.0080240.0011000.000350
Copper and its compoundsCopper, metal7440-50-80.0072940.0010000.000318
Iron and its compoundsIron, metal7439-89-60.0124010.0017000.000541
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1262.61366236.00150011.451685
Nickel and its compoundsNickel, metal7440-02-00.0269900.0037000.001177
Silver and its compoundsSilver, metal7440-22-414.5292251.9918000.633570
Tin and its compoundsTin, metal7440-31-5452.21793261.99420019.719679
Zinc and its compoundsZinc, metal7440-66-60.0072940.0010000.000318
Subtotal729.452000100.000000031.808910
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium sulfate7727-43-732.8120664.9453001.430822
Copper and its compoundsCopper, metal7440-50-8245.16789436.95070010.690934
Gold and its compoundsGold, metal7440-57-52.0024430.3018000.087320
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3141.14967321.2735006.155055
Inorganic Silicon compoundsSilica, vitreous60676-86-012.8320901.9340000.559564
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6767700.1020000.029512
Magnesium and its compoundsTalc14807-96-63.3825230.5098000.147500
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0258770.0039000.001128
Nickel and its compoundsNickel, metal7440-02-012.6934181.9131000.553517
Organic compoundsOther organic compounds.4.0592930.6118000.177012
PolymersPlastic: EP - Epoxide, Epoxy22.0998583.3308000.963699
PolymersPlastic: PAK49.7253447.4944002.168352
PolymersPlastic: PI - Polyimide136.87275120.6289005.968553
Subtotal663.500000100.000000028.932968
Total2293.231701100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC860TZQ50D4R2
Product content declaration of MPC860TZQ50D4R2
上次修订 Last Revision (GMT):
Tuesday, 17 August 2021, 03:39:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC860TZQ50D4R2Last Revision (GMT):
Tuesday, 17 August 2021, 03:39:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Test Report
22 Apr 2021
Die EncapsulantTest Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
22 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.