MPC875VR66

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC875VR66Last Revision (GMT):
Saturday, 14 May 2022, 02:28:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC875VR66SOT1667-1BGA2561671.592570 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 095 355572020-10-15113 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-514.29949099.9900000.855441
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014300.0100000.000086
Subtotal14.300920100.00000000.855527
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.9312673.0895001.431645
Arsenic and its compoundsArsenic, metal7440-38-20.0077460.0010000.000463
Cadmium and its compoundsCadmium, metal7440-43-90.0077460.0010000.000463
Epoxy ResinsProprietary Material-Other Epoxy resins23.9312673.0895001.431645
Inorganic Silicon compoundsSilica, vitreous60676-86-0678.05308187.53590040.563298
Inorganic compoundsCarbon Black1333-86-42.3935140.3090000.143188
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0077460.0010000.000463
Organic Phosphorus compoundsOther organic phosphorous compounds2.3935140.3090000.143188
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins43.8741195.6641002.624690
Subtotal774.600000100.000000046.339043
Epoxy AdhesiveEpoxy AdhesiveAniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-40.8550005.0000000.051149
Aromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1282500.7500000.007672
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.96651711.5001000.117643
Glycidyl ethersP-Tertbutylphenyl glycidyl ether3101-60-80.8550005.0000000.051149
Glycol Ethers and Acetates - Specific2-butoxyethyl acetate112-07-20.2137501.2500000.012787
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1282500.7500000.007672
Silver and its compoundsSilver, metal7440-22-412.95323375.7499000.774904
Subtotal17.100000100.00000001.022976
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped51.79363798.0000003.098461
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0570132.0000000.063234
Subtotal52.850650100.00000003.161694
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0044130.0010000.000264
Arsenic and its compoundsArsenic, metal7440-38-20.0044130.0010000.000264
Bismuth and its compoundsBismuth, metal7440-69-90.0044130.0010000.000264
Copper and its compoundsCopper, metal7440-50-83.0893870.7000000.184817
Iron and its compoundsIron, metal7439-89-60.0079440.0018000.000475
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0247150.0056000.001478
Silver and its compoundsSilver, metal7440-22-416.5944223.7600000.992731
Tin and its compoundsTin, metal7440-31-5421.61129295.52960025.222132
Subtotal441.341000100.000000026.402426
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-32.6354540.7096000.157661
Barium and its compoundsBarium sulfate7727-43-724.4570616.5851001.463099
Copper and its compoundsCopper, metal7440-50-830.3062408.1600001.813016
Epoxy ResinsBisphenol A diglycidyl ether1675-54-31.3210700.3557000.079031
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-5131.47151535.3989007.865045
Epoxy ResinsProprietary Material-Other Epoxy resins2.2841100.6150000.136643
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-614.0203503.7750000.838742
Gold and its compoundsGold, metal7440-57-50.7821680.2106000.046792
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3124.87916533.6239007.470670
Inorganic Silicon compoundsSilicon7440-21-30.3164330.0852000.018930
Nickel and its compoundsNickel, metal7440-02-07.9345902.1364000.474672
PolymersOther acrylic resins18.5948845.0067001.112405
PolymersOther acrylic/epoxy resin mixture12.3969613.3379000.741626
Subtotal371.400000100.000000022.218333
Total1671.592570100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC875VR66
Product content declaration of MPC875VR66
上次修订 Last Revision (GMT):
Saturday, 14 May 2022, 02:28:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC875VR66Last Revision (GMT):
Saturday, 14 May 2022, 02:28:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Die EncapsulantTest Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Test Report
17 May 2021
Epoxy AdhesiveTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Semiconductor DieTest Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Solder Ball - SAC, Lead FreeTest Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Test Report
5 Aug 2021
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.