MPC875ZT133

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC875ZT133Last Revision (GMT):
Tuesday, 17 August 2021, 03:48:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC875ZT133SOT1667-1BGA2561813.873285 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 227 455572020-01-206Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000001.201573
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.066754
Tin and its compoundsTin, metal7440-31-537.53586362.0000002.069376
Subtotal60.541715100.00000003.337704
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-514.29949099.9900000.788340
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014300.0100000.000079
Subtotal14.300920100.00000000.788419
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.9312673.0895001.319346
Arsenic and its compoundsArsenic, metal7440-38-20.0077460.0010000.000427
Cadmium and its compoundsCadmium, metal7440-43-90.0077460.0010000.000427
Epoxy ResinsProprietary Material-Other Epoxy resins23.9312673.0895001.319346
Inorganic Silicon compoundsSilica, vitreous60676-86-0678.05308187.53590037.381502
Inorganic compoundsCarbon Black1333-86-42.3935140.3090000.131956
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0077460.0010000.000427
Organic Phosphorus compoundsOther organic phosphorous compounds2.3935140.3090000.131956
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins43.8741195.6641002.418808
Subtotal774.600000100.000000042.704196
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1445120.8451000.007967
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.21580112.9579000.122159
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1445120.8451000.007967
Silver and its compoundsSilver, metal7440-22-414.59517585.3519000.804641
Subtotal17.100000100.00000000.942734
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped51.79363798.0000002.855417
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0570132.0000000.058274
Subtotal52.850650100.00000002.913690
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0052310.0010000.000288
Antimony and its compoundsAntimony, metal7440-36-00.0052310.0010000.000288
Arsenic and its compoundsArsenic, metal7440-38-20.0104620.0020000.000577
Bismuth and its compoundsBismuth, metal7440-69-90.0057540.0011000.000317
Copper and its compoundsCopper, metal7440-50-80.0052310.0010000.000288
Iron and its compoundsIron, metal7439-89-60.0088920.0017000.000490
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1188.31664636.00150010.382018
Nickel and its compoundsNickel, metal7440-02-00.0193540.0037000.001067
Silver and its compoundsSilver, metal7440-22-410.4187071.9918000.574390
Tin and its compoundsTin, metal7440-31-5324.27926161.99420017.877724
Zinc and its compoundsZinc, metal7440-66-60.0052310.0010000.000288
Subtotal523.080000100.000000028.837737
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-32.6354540.7096000.145294
Barium and its compoundsBarium sulfate7727-43-724.4570616.5851001.348334
Copper and its compoundsCopper, metal7440-50-830.3062408.1600001.670802
Epoxy ResinsBisphenol A diglycidyl ether1675-54-31.3210700.3557000.072831
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-5131.47151535.3989007.248109
Epoxy ResinsProprietary Material-Other Epoxy resins2.2841100.6150000.125924
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-614.0203503.7750000.772951
Gold and its compoundsGold, metal7440-57-50.7821680.2106000.043121
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3124.87916533.6239006.884669
Inorganic Silicon compoundsSilicon7440-21-30.3164330.0852000.017445
Nickel and its compoundsNickel, metal7440-02-07.9345902.1364000.437439
PolymersOther acrylic resins18.5948845.0067001.025148
PolymersOther acrylic/epoxy resin mixture12.3969613.3379000.683452
Subtotal371.400000100.000000020.475521
Total1813.873285100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC875ZT133
Product content declaration of MPC875ZT133
上次修订 Last Revision (GMT):
Tuesday, 17 August 2021, 03:48:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC875ZT133Last Revision (GMT):
Tuesday, 17 August 2021, 03:48:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.