MPC880ZP133

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPC880ZP133Last Revision (GMT):
Wednesday, 06 March 2024, 11:21:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC880ZP133SOT1666-1BGA3572301.634315 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 192 195572024-02-069Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-121.79501736.0000000.946937
Silver and its compoundsSilver, metal7440-22-41.2108342.0000000.052608
Tin and its compoundsTin, metal7440-31-537.53586362.0000001.630835
Subtotal60.541715100.00000002.630379
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-86.00425197.0000000.260869
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1856983.0000000.008068
Subtotal6.189950100.00000000.268937
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins46.9500006.0000002.039855
Inorganic Silicon compoundsSilica, vitreous60676-86-0579.05000074.00000025.158210
Inorganic Silicon compoundsSilicon dioxide7631-86-9117.37500015.0000005.099637
Inorganic compoundsCarbon Black1333-86-43.9125000.5000000.169988
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-415.6500002.0000000.679952
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins19.5625002.5000000.849939
Subtotal782.500000100.000000033.997581
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.79200012.0000000.034410
Epoxy ResinsProprietary Material-Other Epoxy resins0.4620007.0000000.020073
Silver and its compoundsSilver, metal7440-22-45.34600081.0000000.232270
Subtotal6.600000100.00000000.286753
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped51.79363798.0000002.250298
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0570132.0000000.045925
Subtotal52.850650100.00000002.296223
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0072940.0010000.000317
Antimony and its compoundsAntimony, metal7440-36-00.0072940.0010000.000317
Arsenic and its compoundsArsenic, metal7440-38-20.0145890.0020000.000634
Bismuth and its compoundsBismuth, metal7440-69-90.0080240.0011000.000349
Copper and its compoundsCopper, metal7440-50-80.0072940.0010000.000317
Iron and its compoundsIron, metal7439-89-60.0124010.0017000.000539
Lead and its compoundsLead, metallic lead and lead alloys7439-92-1262.61366236.00150011.409878
Nickel and its compoundsNickel, metal7440-02-00.0269900.0037000.001173
Silver and its compoundsSilver, metal7440-22-414.5292251.9918000.631257
Tin and its compoundsTin, metal7440-31-5452.21793261.99420019.647688
Zinc and its compoundsZinc, metal7440-66-60.0072940.0010000.000317
Subtotal729.452000100.000000031.692784
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8257.61128699.99000011.192538
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0257640.0100000.001119
Subtotal257.637050100.000000011.193657
Copper PlatingCopper and its compoundsCopper, metal7440-50-886.90111699.9800003.775627
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0173840.0200000.000755
Subtotal86.918500100.00000003.776382
Gold PlatingGold and its compoundsGold, metal7440-57-52.38836199.9900000.103768
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002390.0100000.000010
Subtotal2.388600100.00000000.103778
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0045780.0300000.000199
Nickel and its compoundsNickel, metal7440-02-015.25592299.9700000.662830
Subtotal15.260500100.00000000.663029
Solder MaskBarium and its compoundsBarium sulfate7727-43-733.38327329.1000001.450416
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6883150.6000000.029906
Magnesium and its compoundsTalc14807-96-63.4415753.0000000.149527
Organic compoundsOther organic compounds.4.1298893.6000000.179433
PolymersPlastic: EP - Epoxide, Epoxy22.48495319.6000000.976912
PolymersPlastic: PAK50.59114544.1000002.198053
Subtotal114.719150100.00000004.984247
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-388.81027147.6000003.858574
Inorganic Silicon compoundsSilica, vitreous60676-86-08.9556584.8000000.389100
PolymersPlastic: PI - Polyimide88.81027147.6000003.858574
Subtotal186.576200100.00000008.106248
Total2301.634315100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPC880ZP133
Product content declaration of MPC880ZP133
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 11:21:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)

焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPC880ZP133Last Revision (GMT):
Wednesday, 06 March 2024, 11:21:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Test Report
1 Nov 2023
Semiconductor DieTest Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
CU FOILTest Report
21 Dec 2021
Test Report
7 Jan 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FGBTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.