MPVZ5004G6U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPVZ5004G6ULast Revision (GMT):
Tuesday, 27 February 2024, 10:12:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPVZ5004G6USOT1694-1SO81259.790002 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 391742023-11-243NA / Not Available24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5184.45646599.99000014.641842
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0184470.0100000.001464
Subtotal184.474912100.000000014.643306
CapCapChromium and Chromium III compoundsChromium, metal7440-47-322.12540011.3000001.756277
Copper and its compoundsCopper, metal7440-50-81.4685000.7500000.116567
Inorganic Silicon compoundsSilicon7440-21-30.9790000.5000000.077711
Inorganic compoundsCarbon7440-44-00.0195800.0100000.001554
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000777
Iron and its compoundsIron, metal7439-89-6169.68028086.66000013.468934
Manganese and its compoundsManganese, metal7439-96-50.4895000.2500000.038856
Nickel and its compoundsNickel, metal7440-02-00.2937000.1500000.023313
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3426500.1750000.027199
Titanium and its compoundsTitanium, metal7440-32-60.3916000.2000000.031085
Subtotal195.800000100.000000015.542273
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-8418.85640297.60000033.248113
Iron and its compoundsIron, metal7439-89-610.2997482.4000000.817577
Subtotal429.156150100.000000034.065689
Gold PlatingGold and its compoundsGold, metal7440-57-50.23739099.9000000.018844
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002380.1000000.000019
Subtotal0.237628100.00000000.018863
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0030100.1000000.000239
Nickel and its compoundsNickel, metal7440-02-03.00694499.9000000.238686
Subtotal3.009955100.00000000.238925
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003960.1000000.000031
Palladium and its compoundsPalladium, metal7440-05-30.39565199.9000000.031406
Subtotal0.396047100.00000000.031438
Polyimide CoatingInorganic Silicon compoundsFibrous-glass-wool65997-17-3197.61143655.00000015.686062
PolymersPolyphenylene Sulfide (PPS)26125-40-6161.68208445.00000012.834050
Subtotal359.293521100.000000028.520112
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-328.78200078.0000002.284667
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-58.11800022.0000000.644393
Subtotal36.900000100.00000002.929060
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-328.78200078.0000002.284667
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-58.11800022.0000000.644393
Subtotal36.900000100.00000002.929060
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0810003.0000000.006430
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.67500025.0000000.053580
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.67500025.0000000.053580
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.26900047.0000000.100731
Subtotal2.700000100.00000000.214321
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-310.70335498.0000000.849614
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2184362.0000000.017339
Subtotal10.921790100.00000000.866953
Total1259.790002100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPVZ5004G6U
Product content declaration of MPVZ5004G6U
上次修订 Last Revision (GMT):
Tuesday, 27 February 2024, 10:12:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPVZ5004G6ULast Revision (GMT):
Tuesday, 27 February 2024, 10:12:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
FORTRON RESINTest Report
2 Jan 2019
Test Report
2 Jan 2019
Test Report
2 Jan 2019
Test Report
13 Mar 2019
NI PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
PD PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die Encapsulant 1Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Die Encapsulant 2Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Epoxy AdhesiveTest Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.