MPVZ5004GW7U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPVZ5004GW7ULast Revision (GMT):
Thursday, 06 July 2023, 09:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPVZ5004GW7USOT1691-1SO81315.321666 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 192 221742023-11-243NA / Not Available22030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.99977699.9900000.076010
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001000.0100000.000008
Subtotal0.999876100.00000000.076018
CapCapChromium and Chromium III compoundsChromium, metal7440-47-322.12540011.3000001.682128
Copper and its compoundsCopper, metal7440-50-81.4685000.7500000.111646
Inorganic Silicon compoundsSilicon7440-21-30.9790000.5000000.074430
Inorganic compoundsCarbon7440-44-00.0195800.0100000.001489
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000744
Iron and its compoundsIron, metal7439-89-6169.68028086.66000012.900288
Manganese and its compoundsManganese, metal7439-96-50.4895000.2500000.037215
Nickel and its compoundsNickel, metal7440-02-00.2937000.1500000.022329
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3426500.1750000.026051
Titanium and its compoundsTitanium, metal7440-32-60.3916000.2000000.029772
Subtotal195.800000100.000000014.886093
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8182.26709522.98740013.857226
Gold and its compoundsGold, metal7440-57-50.1712660.0216000.013021
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3119.72552115.0997009.102376
Inorganic compoundsProprietary Material - Other inorganic compounds117.83445514.8612008.958604
Iron and its compoundsIron, metal7439-89-64.4426190.5603000.337759
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0325090.0041000.002472
Nickel and its compoundsNickel, metal7440-02-06.5771060.8295000.500038
Palladium and its compoundsPalladium, metal7440-05-30.3346040.0422000.025439
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.1562010.0197000.011876
PolymersPolyphenylene Sulfide (PPS)26125-40-6361.06525245.53730027.450719
Tin and its compoundsTin, metal7440-31-50.0570890.0072000.004340
Zinc and its compoundsZinc, metal7440-66-60.2362840.0298000.017964
Subtotal792.900000100.000000060.281832
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-314.50800078.0000001.103000
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-54.09200022.0000000.311103
Subtotal18.600000100.00000001.414103
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-314.50800078.0000001.103000
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-54.09200022.0000000.311103
Subtotal18.600000100.00000001.414103
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0840003.0000000.006386
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.70000025.0000000.053219
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.70000025.0000000.053219
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.31600047.0000000.100052
Subtotal2.800000100.00000000.212876
Epoxy Adhesive 2Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds9.54000045.0000000.725298
Guanidine compoundsOther guanidine compounds0.5300002.5000000.040294
Inorganic compoundsCarbon Black1333-86-40.5300002.5000000.040294
Phenols and Phenolic ResinsOther phenolic resins10.60000050.0000000.805886
Subtotal21.200000100.00000001.611773
PortPortInorganic Silicon compoundsFibrous-glass-wool65997-17-3101.40000040.0000007.709141
Inorganic compoundsCarbon Black1333-86-41.2675000.5000000.096364
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.5350001.0000000.192728
PolymersPolyphenylene Sulfide (PPS)26125-40-6148.29750058.50000011.274619
Subtotal253.500000100.000000019.272852
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-310.70335498.0000000.813744
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2184362.0000000.016607
Subtotal10.921790100.00000000.830351
Total1315.321666100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPVZ5004GW7U
Product content declaration of MPVZ5004GW7U
上次修订 Last Revision (GMT):
Thursday, 06 July 2023, 09:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
端口
Port
端口
Port
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPVZ5004GW7ULast Revision (GMT):
Thursday, 06 July 2023, 09:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
20 Nov 2020
Test Report
21 Dec 2018
Test Report
21 Dec 2018
Test Report
21 Dec 2018
CDA 194Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
NI PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
PD PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Die Encapsulant 1Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Die Encapsulant 2Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Epoxy Adhesive 1Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
PortNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.