MPX2102A

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MPX2102ALast Revision (GMT):
Thursday, 22 December 2022, 06:59:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPX2102ASOT1772-1UNIBODY4F679.967308 mg NoNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 095 241172022-10-278Not ApplicableNot ApplicableNot ApplicableNA / Not Available22030 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-583.84366399.99000012.330543
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0083850.0100000.001233
Subtotal83.852048100.000000012.331776
CapCapChromium and Chromium III compoundsChromium, metal7440-47-352.49520018.4000007.720254
Copper and its compoundsCopper, metal7440-50-80.7132500.2500000.104895
Inorganic Silicon compoundsSilicon7440-21-31.4265000.5000000.209789
Inorganic compoundsCarbon7440-44-00.1355180.0475000.019930
Inorganic compoundsSulfur7704-34-90.0142650.0050000.002098
Iron and its compoundsIron, metal7439-89-6202.93389071.13000029.844654
Manganese and its compoundsManganese, metal7439-96-53.2809501.1500000.482516
Nickel and its compoundsNickel, metal7440-02-023.9652008.4000003.524464
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0499270.0175000.007343
Titanium and its compoundsTitanium, metal7440-32-60.2853000.1000000.041958
Subtotal285.300000100.000000041.957899
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8162.94287796.83280023.963340
Gold and its compoundsGold, metal7440-57-50.0168270.0100000.002475
Iron and its compoundsIron, metal7439-89-63.6452852.1663000.536097
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0026920.0016000.000396
Nickel and its compoundsNickel, metal7440-02-01.4027190.8336000.206292
Palladium and its compoundsPalladium, metal7440-05-30.0713470.0424000.010493
Zinc and its compoundsZinc, metal7440-66-60.1906530.1133000.028039
Subtotal168.272400100.000000024.747131
Die EncapsulantDie EncapsulantOrganic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.3477300.3061000.051139
Organic Silicon compoundsDimethyl Siloxane69430-24-65.2162854.5918000.767138
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones108.03598695.10210015.888409
Subtotal113.600000100.000000016.706686
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2460003.0000000.036178
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-92.05000025.0000000.301485
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-12.05000025.0000000.301485
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-23.85400047.0000000.566792
Subtotal8.200000100.00000001.205940
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins7.29800089.0000001.073287
Epoxy ResinsOther Non-halogenated Epoxy resins0.82000010.0000000.120594
Inorganic compoundsCarbon Black1333-86-40.0820001.0000000.012059
Subtotal8.200000100.00000001.205940
Epoxy Adhesive 3Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds3.69000045.0000000.542673
Guanidine compoundsOther guanidine compounds0.2050002.5000000.030149
Inorganic compoundsCarbon Black1333-86-40.2050002.5000000.030149
Phenols and Phenolic ResinsOther phenolic resins4.10000050.0000000.602970
Subtotal8.200000100.00000001.205940
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-34.23472398.0000000.622783
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0864232.0000000.012710
Subtotal4.321146100.00000000.635493
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0002171.0000000.000032
Boron and its compoundsBoron oxide1303-86-20.0017378.0000000.000255
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0006513.0000000.000096
Lead and its compoundsLead monooxide1317-36-80.01161753.5000000.001708
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.00749134.5000000.001102
Subtotal0.021714100.00000000.003193
Total679.967308100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPX2102A
Product content declaration of MPX2102A
上次修订 Last Revision (GMT):
Thursday, 22 December 2022, 06:59:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPX2102ALast Revision (GMT):
Thursday, 22 December 2022, 06:59:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
CapTest Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
Test Report
20 Jan 2020
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Die EncapsulantTest Report
24 Mar 2021
Test Report
24 Mar 2021
Test Report
24 Mar 2021
Test Report
24 Mar 2021
Epoxy Adhesive 1Test Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
Epoxy Adhesive 2Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Epoxy Adhesive 3Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.