MPX4080D

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPX4080DLast Revision (GMT):
Thursday, 06 July 2023, 08:41:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPX4080DSOT1877-1SIL62172.324392 mg NoYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 168 221172021-05-154NA / Not Available22030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5167.68773299.9900007.719277
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0167710.0100000.000772
Subtotal167.704502100.00000007.720049
CapCapChromium and Chromium III compoundsChromium, metal7440-47-332.23890011.3000001.484074
Copper and its compoundsCopper, metal7440-50-82.1397500.7500000.098501
Inorganic Silicon compoundsSilicon7440-21-31.4265000.5000000.065667
Inorganic compoundsCarbon7440-44-00.0285300.0100000.001313
Inorganic compoundsSulfur7704-34-90.0142650.0050000.000657
Iron and its compoundsIron, metal7439-89-6247.24098086.66000011.381402
Manganese and its compoundsManganese, metal7439-96-50.7132500.2500000.032834
Nickel and its compoundsNickel, metal7440-02-00.4279500.1500000.019700
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.4992750.1750000.022983
Titanium and its compoundsTitanium, metal7440-32-60.5706000.2000000.026267
Subtotal285.300000100.000000013.133398
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8367.60258296.81120016.922085
Gold and its compoundsGold, metal7440-57-50.0379710.0100000.001748
Iron and its compoundsIron, metal7439-89-68.2852902.1820000.381402
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0060750.0016000.000280
Nickel and its compoundsNickel, metal7440-02-03.1808370.8377000.146425
Palladium and its compoundsPalladium, metal7440-05-30.1617570.0426000.007446
Zinc and its compoundsZinc, metal7440-66-60.4362880.1149000.020084
Subtotal379.710800100.000000017.479470
Die Encapsulant 1Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0150300.0100000.000692
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-2150.28497099.9900006.918164
Subtotal150.300000100.00000006.918856
Die Encapsulant 2Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0150300.0100000.000692
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-2150.28497099.9900006.918164
Subtotal150.300000100.00000006.918856
Die Encapsulant 3Die EncapsulantAntimony OxidesAntimony(III) oxide1309-64-425.4075002.5000001.169600
Brominated Flame Retardants (excluding banned groups)Bromophenol, formaldehyde, epichlorohydrin polymer68541-56-040.6520004.0000001.871360
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-2162.60800016.0000007.485438
Inorganic Silicon compoundsSilica, vitreous60676-86-0691.08400068.00000031.813112
Inorganic compoundsCarbon Black1333-86-45.0815000.5000000.233920
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins91.4670009.0000004.210559
Subtotal1016.300000100.000000046.783989
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2340003.0000000.010772
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-91.95000025.0000000.089766
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-11.95000025.0000000.089766
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-23.66600047.0000000.168759
Subtotal7.800000100.00000000.359062
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins4.71700089.0000000.217141
Epoxy ResinsOther Non-halogenated Epoxy resins0.53000010.0000000.024398
Inorganic compoundsCarbon Black1333-86-40.0530001.0000000.002440
Subtotal5.300000100.00000000.243978
Epoxy Adhesive 3Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds2.38500045.0000000.109790
Guanidine compoundsOther guanidine compounds0.1325002.5000000.006099
Inorganic compoundsCarbon Black1333-86-40.1325002.5000000.006099
Phenols and Phenolic ResinsOther phenolic resins2.65000050.0000000.121989
Subtotal5.300000100.00000000.243978
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-34.22290898.0000000.194396
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0861822.0000000.003967
Subtotal4.309090100.00000000.198363
Total2172.324392100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPX4080D
Product content declaration of MPX4080D
上次修订 Last Revision (GMT):
Thursday, 06 July 2023, 08:41:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPX4080DLast Revision (GMT):
Thursday, 06 July 2023, 08:41:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
19 Jan 2023
Test Report
19 Jan 2023
Test Report
19 Jan 2023
Test Report
19 Jan 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
C194Test Report
25 Jan 2023
Test Report
25 Jan 2023
Test Report
25 Jan 2023
Test Report
25 Jan 2023
NI PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
PD PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Die Encapsulant 1Test Report
2 Nov 2022
Test Report
2 Nov 2022
Test Report
2 Nov 2022
Test Report
2 Nov 2022
Die Encapsulant 2Test Report
2 Nov 2022
Test Report
2 Nov 2022
Test Report
2 Nov 2022
Test Report
2 Nov 2022
Die Encapsulant 3Test Report
8 Aug 2022
Test Report
8 Aug 2022
Not AvailableNot Available
Epoxy Adhesive 1Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Epoxy Adhesive 2Test Report
26 Dec 2022
Test Report
26 Dec 2022
Test Report
26 Dec 2022
Test Report
26 Dec 2022
Epoxy Adhesive 3Test Report
26 Dec 2022
Test Report
26 Dec 2022
Test Report
26 Dec 2022
Test Report
26 Dec 2022
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.