MPXA4250A6U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXA4250A6ULast Revision (GMT):
Friday, 27 September 2024, 11:04:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXA4250A6USOT1694-1SO81254.374712 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 211 741742024-09-279NA / Not Available24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5184.45646599.99000014.705053
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0184470.0100000.001471
Subtotal184.474912100.000000014.706524
CapCapChromium and Chromium III compoundsChromium, metal7440-47-322.12540011.3000001.763859
Copper and its compoundsCopper, metal7440-50-81.4685000.7500000.117070
Inorganic Silicon compoundsSilicon7440-21-30.9790000.5000000.078047
Inorganic compoundsCarbon7440-44-00.0195800.0100000.001561
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000781
Iron and its compoundsIron, metal7439-89-6169.68028086.66000013.527081
Manganese and its compoundsManganese, metal7439-96-50.4895000.2500000.039023
Nickel and its compoundsNickel, metal7440-02-00.2937000.1500000.023414
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3426500.1750000.027316
Titanium and its compoundsTitanium, metal7440-32-60.3916000.2000000.031219
Subtotal195.800000100.000000015.609371
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-8415.00501797.60000033.084613
Iron and its compoundsIron, metal7439-89-610.2050412.4000000.813556
Subtotal425.210058100.000000033.898169
Gold PlatingGold and its compoundsGold, metal7440-57-50.23520899.9000000.018751
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002350.1000000.000019
Subtotal0.235443100.00000000.018770
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0029820.1000000.000238
Nickel and its compoundsNickel, metal7440-02-02.97929699.9000000.237512
Subtotal2.982278100.00000000.237750
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003920.1000000.000031
Palladium and its compoundsPalladium, metal7440-05-30.39201399.9000000.031252
Subtotal0.392405100.00000000.031283
Polyimide CoatingInorganic Silicon compoundsFibrous-glass-wool65997-17-3195.79439955.00000015.608924
PolymersPolyphenylene Sulfide (PPS)26125-40-6160.19541745.00000012.770938
Subtotal355.989816100.000000028.379862
Die Encapsulant 1Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036900.0100000.000294
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-236.89631099.9900002.941410
Subtotal36.900000100.00000002.941705
Die Encapsulant 2Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036900.0100000.000294
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-236.89631099.9900002.941410
Subtotal36.900000100.00000002.941705
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0810003.0000000.006457
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.67500025.0000000.053812
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.67500025.0000000.053812
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.26900047.0000000.101166
Subtotal2.700000100.00000000.215247
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-312.53400498.0000000.999223
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2557962.0000000.020392
Subtotal12.789800100.00000001.019616
Total1254.374712100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXA4250A6U
Product content declaration of MPXA4250A6U
上次修订 Last Revision (GMT):
Friday, 27 September 2024, 11:04:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXA4250A6ULast Revision (GMT):
Friday, 27 September 2024, 11:04:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
Test Report
5 Mar 2024
CapTest Report
12 Jul 2024
Test Report
12 Jul 2024
Test Report
12 Jul 2024
Test Report
12 Jul 2024
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
CDA 194Test Report
24 Jan 2024
Test Report
24 Jan 2024
Test Report
24 Jan 2024
Test Report
24 Jan 2024
FORTRON RESINNot AvailableNot AvailableNot AvailableNot Available
NI PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
PD PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Die Encapsulant 1Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Die Encapsulant 2Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Epoxy AdhesiveTest Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Test Report
26 Mar 2024
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.