MPXHZ6116A6U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXHZ6116A6ULast Revision (GMT):
Thursday, 21 April 2022, 06:14:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXHZ6116A6USOT1709-1SO8361.611466 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 243 031742021-06-229Not ApplicableNot ApplicableNot ApplicableNA / Not Available25030 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.59990699.9900000.165898
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000600.0100000.000017
Subtotal0.599966100.00000000.165914
CapCapChromium and Chromium III compoundsChromium, metal7440-47-314.57947418.0216004.031806
Inorganic Silicon compoundsSilicon7440-21-30.6074780.7509000.167992
Inorganic compoundsSulfur7704-34-90.0242700.0300000.006712
Iron and its compoundsIron, metal7439-89-664.84644780.15630017.932630
Manganese and its compoundsManganese, metal7439-96-50.8099711.0012000.223989
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0323600.0400000.008949
Subtotal80.900000100.000000022.372078
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-8213.35184797.29100059.000299
Iron and its compoundsIron, metal7439-89-65.1972322.3700001.437242
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0372800.0170000.010309
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3640260.1660000.100668
Tin and its compoundsTin, metal7440-31-50.0657880.0300000.018193
Zinc and its compoundsZinc, metal7440-66-60.2763090.1260000.076410
Subtotal219.292480100.000000060.643121
Gold PlatingGold and its compoundsGold, metal7440-57-50.16892899.9900000.046715
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000170.0100000.000005
Subtotal0.168945100.00000000.046720
Mold CompoundInorganic Silicon compoundsFibrous-glass-wool65997-17-312.38517740.0000003.424996
Inorganic compoundsCarbon Black1333-86-40.1548150.5000000.042812
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3096291.0000000.085625
PolymersPolyphenylene Sulfide (PPS)26125-40-618.11332258.5000005.009056
Subtotal30.962943100.00000008.562489
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002370.0100000.000066
Nickel and its compoundsNickel, metal7440-02-02.37080899.9900000.655623
Subtotal2.371045100.00000000.655689
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000120.0100000.000003
Palladium and its compoundsPalladium, metal7440-05-30.11607599.9900000.032099
Subtotal0.116086100.00000000.032102
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-310.37400078.0000002.868825
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-52.92600022.0000000.809156
Subtotal13.300000100.00000003.677981
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-310.37400078.0000002.868825
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-52.92600022.0000000.809156
Subtotal13.300000100.00000003.677981
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0180003.0000000.004978
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.15000025.0000000.041481
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.15000025.0000000.041481
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.28200047.0000000.077984
Subtotal0.600000100.00000000.165924
Total361.611466100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXHZ6116A6U
Product content declaration of MPXHZ6116A6U
上次修订 Last Revision (GMT):
Thursday, 21 April 2022, 06:14:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

模塑料
Mold Compound
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXHZ6116A6ULast Revision (GMT):
Thursday, 21 April 2022, 06:14:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
CapTest Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Test Report
3 Jan 2019
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
20 Nov 2020
Test Report
21 Dec 2018
Test Report
21 Dec 2018
Test Report
21 Dec 2018
CDA 194Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
FORTRON RESINTest Report
2 Mar 2018
Test Report
2 Mar 2018
Test Report
2 Mar 2018
Not Available
NI PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
PD PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Die Encapsulant 1Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Die Encapsulant 2Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Test Report
14 Jun 2018
Epoxy AdhesiveTest Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
Test Report
17 Sep 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.