MPXHZ6130AC6U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXHZ6130AC6ULast Revision (GMT):
Tuesday, 05 March 2024, 01:03:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXHZ6130AC6USOT1710-1SO8631.679147 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 137 471742023-11-2413Not ApplicableNot ApplicableNot ApplicableNA / Not Available25030 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5100.61239599.99000015.927769
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0100620.0100000.001593
Subtotal100.622457100.000000015.929362
CapCapChromium and Chromium III compoundsChromium, metal7440-47-39.14170011.3000001.447206
Copper and its compoundsCopper, metal7440-50-80.6067500.7500000.096053
Inorganic Silicon compoundsSilicon7440-21-30.4045000.5000000.064036
Inorganic compoundsCarbon7440-44-00.0080900.0100000.001281
Inorganic compoundsSulfur7704-34-90.0040450.0050000.000640
Iron and its compoundsIron, metal7439-89-670.10794086.66000011.098663
Manganese and its compoundsManganese, metal7439-96-50.2022500.2500000.032018
Nickel and its compoundsNickel, metal7440-02-00.1213500.1500000.019211
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.1415750.1750000.022412
Titanium and its compoundsTitanium, metal7440-32-60.1618000.2000000.025614
Subtotal80.900000100.000000012.807135
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-8205.66844197.60000032.559004
Iron and its compoundsIron, metal7439-89-65.0574212.4000000.800631
Subtotal210.725862100.000000033.359636
Gold PlatingGold and its compoundsGold, metal7440-57-50.07579899.9000000.011999
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000760.1000000.000012
Subtotal0.075873100.00000000.012011
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0010620.1000000.000168
Nickel and its compoundsNickel, metal7440-02-01.06116699.9000000.167991
Subtotal1.062228100.00000000.168159
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0001270.1000000.000020
Palladium and its compoundsPalladium, metal7440-05-30.12632999.9000000.019999
Subtotal0.126456100.00000000.020019
Polyimide CoatingInorganic Silicon compoundsFibrous-glass-wool65997-17-322.50659455.0000003.562979
PolymersPolyphenylene Sulfide (PPS)26125-40-618.41448645.0000002.915164
Subtotal40.921081100.00000006.478143
Die Encapsulant 1Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-320.74800078.0000003.284579
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-55.85200022.0000000.926420
Subtotal26.600000100.00000004.210999
Die Encapsulant 2Die EncapsulantOrganic Silicon compoundsFluorosilicone monomer (fluorosilicone rubber)2374-14-320.74800078.0000003.284579
PolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-55.85200022.0000000.926420
Subtotal26.600000100.00000004.210999
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0180003.0000000.002850
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.15000025.0000000.023746
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.15000025.0000000.023746
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.28200047.0000000.044643
Subtotal0.600000100.00000000.094985
Epoxy Adhesive 2Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds0.27000045.0000000.042743
Guanidine compoundsOther guanidine compounds0.0150002.5000000.002375
Inorganic compoundsCarbon Black1333-86-40.0150002.5000000.002375
Phenols and Phenolic ResinsOther phenolic resins0.30000050.0000000.047492
Subtotal0.600000100.00000000.094985
PortPortInorganic Silicon compoundsFibrous-glass-wool65997-17-352.20000040.0000008.263689
Inorganic compoundsCarbon Black1333-86-40.6525000.5000000.103296
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.3050001.0000000.206592
PolymersPolyphenylene Sulfide (PPS)26125-40-676.34250058.50000012.085645
Subtotal130.500000100.000000020.659222
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-312.03779598.0000001.905682
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2456692.0000000.038892
Subtotal12.283464100.00000001.944573
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0006171.0000000.000098
Boron and its compoundsBoron oxide1303-86-20.0049388.0000000.000782
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0018523.0000000.000293
Lead and its compoundsLead monooxide1317-36-80.03302353.5000000.005228
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.02129534.5000000.003371
Subtotal0.061726100.00000000.009772
Total631.679147100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXHZ6130AC6U
Product content declaration of MPXHZ6130AC6U
上次修订 Last Revision (GMT):
Tuesday, 05 March 2024, 01:03:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
端口
Port
端口
Port
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXHZ6130AC6ULast Revision (GMT):
Tuesday, 05 March 2024, 01:03:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
CDA 194Test Report
24 Jan 2024
Test Report
24 Jan 2024
Test Report
24 Jan 2024
Test Report
24 Jan 2024
FORTRON RESINTest Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
Test Report
23 Jan 2024
NI PLATINGTest Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
PD PLATINGTest Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
Test Report
3 Jul 2023
Die Encapsulant 1Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Die Encapsulant 2Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Test Report
14 Nov 2023
Epoxy Adhesive 1Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
PortTest Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Not Available
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.