MPXV2053DP

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXV2053DPLast Revision (GMT):
Thursday, 01 February 2024, 11:29:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXV2053DPSOT1693-1SO82315.420656 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 211 781172023-11-244NA / Not Available24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.89967699.9900000.038856
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000900.0100000.000004
Subtotal0.899766100.00000000.038860
CapCapChromium and Chromium III compoundsChromium, metal7440-47-322.12540011.3000000.955567
Copper and its compoundsCopper, metal7440-50-81.4685000.7500000.063423
Inorganic Silicon compoundsSilicon7440-21-30.9790000.5000000.042282
Inorganic compoundsCarbon7440-44-00.0195800.0100000.000846
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000423
Iron and its compoundsIron, metal7439-89-6169.68028086.6600007.328270
Manganese and its compoundsManganese, metal7439-96-50.4895000.2500000.021141
Nickel and its compoundsNickel, metal7440-02-00.2937000.1500000.012684
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3426500.1750000.014799
Titanium and its compoundsTitanium, metal7440-32-60.3916000.2000000.016913
Subtotal195.800000100.00000008.456347
Copper Lead-Frame, Pre-PlatedCopper AlloyCopper and its compoundsCopper, metal7440-50-8411.64668197.60000017.778484
Iron and its compoundsIron, metal7439-89-610.1224592.4000000.437176
Subtotal421.769140100.000000018.215659
Gold PlatingGold and its compoundsGold, metal7440-57-50.23330499.9000000.010076
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002340.1000000.000010
Subtotal0.233538100.00000000.010086
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0029580.1000000.000128
Nickel and its compoundsNickel, metal7440-02-02.95518699.9000000.127631
Subtotal2.958145100.00000000.127758
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003890.1000000.000017
Palladium and its compoundsPalladium, metal7440-05-30.38884099.9000000.016793
Subtotal0.389230100.00000000.016810
Polyimide CoatingInorganic Silicon compoundsFibrous-glass-wool65997-17-3194.20997655.0000008.387676
PolymersPolyphenylene Sulfide (PPS)26125-40-6158.89907145.0000006.862644
Subtotal353.109048100.000000015.250319
Die EncapsulantDie EncapsulantOrganic Silicon compoundsDimethyl Cyclosiloxanes70900-21-90.1132570.3061000.004891
Organic Silicon compoundsDimethyl Siloxane69430-24-61.6989664.5918000.073376
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones35.18777795.1021001.519714
Subtotal37.000000100.00000001.597982
Epoxy Adhesive 1Epoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0750003.0000000.003239
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.62500025.0000000.026993
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.62500025.0000000.026993
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.17500047.0000000.050747
Subtotal2.500000100.00000000.107972
Epoxy Adhesive 2Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds18.90000045.0000000.816266
Guanidine compoundsOther guanidine compounds1.0500002.5000000.045348
Inorganic compoundsCarbon Black1333-86-41.0500002.5000000.045348
Phenols and Phenolic ResinsOther phenolic resins21.00000050.0000000.906963
Subtotal42.000000100.00000001.813925
Port 1PortInorganic Silicon compoundsFibrous-glass-wool65997-17-3226.21840040.0000009.770078
Inorganic compoundsCarbon Black1333-86-42.8277300.5000000.122126
Miscellaneous substancesOther miscellaneous substances (less than 10%).5.6554601.0000000.244252
PolymersPolyphenylene Sulfide (PPS)26125-40-6330.84441058.50000014.288739
Subtotal565.546000100.000000024.425194
Port 2PortInorganic Silicon compoundsFibrous-glass-wool65997-17-3275.28000040.00000011.888984
Inorganic compoundsCarbon Black1333-86-43.4410000.5000000.148612
Miscellaneous substancesOther miscellaneous substances (less than 10%).6.8820001.0000000.297225
PolymersPolyphenylene Sulfide (PPS)26125-40-6402.59700058.50000017.387640
Subtotal688.200000100.000000029.722461
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-34.91547498.0000000.212293
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1003162.0000000.004333
Subtotal5.015790100.00000000.216625
Total2315.420656100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXV2053DP
Product content declaration of MPXV2053DP
上次修订 Last Revision (GMT):
Thursday, 01 February 2024, 11:29:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

聚酰亚胺涂料
Polyimide Coating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
端口
Port 1
端口
Port
OOOOOO
端口
Port 2
端口
Port
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXV2053DPLast Revision (GMT):
Thursday, 01 February 2024, 11:29:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
C194Test Report
25 Jan 2023
Test Report
25 Jan 2023
Test Report
25 Jan 2023
Test Report
25 Jan 2023
FORTRON RESINTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
NI PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
PD PLATINGTest Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Test Report
2 Jan 2023
Die EncapsulantTest Report
20 Mar 2023
Test Report
20 Mar 2023
Test Report
20 Mar 2023
Test Report
20 Mar 2023
Epoxy Adhesive 1Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Test Report
22 Mar 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Port 1Test Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Port 2Test Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.