MPXV5004GC7U

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXV5004GC7ULast Revision (GMT):
Thursday, 06 July 2023, 11:05:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXV5004GC7USOT1863-1SO81315.521666 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 227 631742023-11-246NA / Not Available24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.99977699.9900000.075998
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001000.0100000.000008
Subtotal0.999876100.00000000.076006
CapCapChromium and Chromium III compoundsChromium, metal7440-47-322.12540011.3000001.681873
Copper and its compoundsCopper, metal7440-50-81.4685000.7500000.111629
Inorganic Silicon compoundsSilicon7440-21-30.9790000.5000000.074419
Inorganic compoundsCarbon7440-44-00.0195800.0100000.001488
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000744
Iron and its compoundsIron, metal7439-89-6169.68028086.66000012.898326
Manganese and its compoundsManganese, metal7439-96-50.4895000.2500000.037210
Nickel and its compoundsNickel, metal7440-02-00.2937000.1500000.022326
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3426500.1750000.026047
Titanium and its compoundsTitanium, metal7440-32-60.3916000.2000000.029768
Subtotal195.800000100.000000014.883829
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8182.26709522.98740013.855119
Gold and its compoundsGold, metal7440-57-50.1712660.0216000.013019
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3119.72552115.0997009.100992
Inorganic compoundsProprietary Material - Other inorganic compounds117.83445514.8612008.957242
Iron and its compoundsIron, metal7439-89-64.4426190.5603000.337708
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0325090.0041000.002471
Nickel and its compoundsNickel, metal7440-02-06.5771060.8295000.499962
Palladium and its compoundsPalladium, metal7440-05-30.3346040.0422000.025435
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.1562010.0197000.011874
PolymersPolyphenylene Sulfide (PPS)26125-40-6361.06525245.53730027.446545
Tin and its compoundsTin, metal7440-31-50.0570890.0072000.004340
Zinc and its compoundsZinc, metal7440-66-60.2362840.0298000.017961
Subtotal792.900000100.000000060.272668
Die Encapsulant 1Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0018700.0100000.000142
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-218.69813099.9900001.421347
Subtotal18.700000100.00000001.421489
Die Encapsulant 2Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0018700.0100000.000142
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-218.69813099.9900001.421347
Subtotal18.700000100.00000001.421489
Epoxy Adhesive 1Epoxy AdhesiveInorganic compoundsCarbon Black1333-86-40.0140000.5000000.001064
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0140000.5000000.001064
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.72800026.0000000.055339
Organic Silicon compoundsVinyl terminated trifluoroproplymethylsiloxane, dimethylsiloxane copolymer68951-98-41.84800066.0000000.140477
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0980003.5000000.007450
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.0980003.5000000.007450
Subtotal2.800000100.00000000.212843
Epoxy Adhesive 2Epoxy AdhesiveAluminum and its compoundsProprietary Material-Other aluminum compounds9.54000045.0000000.725188
Guanidine compoundsOther guanidine compounds0.5300002.5000000.040288
Inorganic compoundsCarbon Black1333-86-40.5300002.5000000.040288
Phenols and Phenolic ResinsOther phenolic resins10.60000050.0000000.805764
Subtotal21.200000100.00000001.611528
PortPortInorganic Silicon compoundsFibrous-glass-wool65997-17-3101.40000040.0000007.707969
Inorganic compoundsCarbon Black1333-86-41.2675000.5000000.096350
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.5350001.0000000.192699
PolymersPolyphenylene Sulfide (PPS)26125-40-6148.29750058.50000011.272904
Subtotal253.500000100.000000019.269922
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-310.70335498.0000000.813620
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2184362.0000000.016605
Subtotal10.921790100.00000000.830225
Total1315.521666100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXV5004GC7U
Product content declaration of MPXV5004GC7U
上次修订 Last Revision (GMT):
Thursday, 06 July 2023, 11:05:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
端口
Port
端口
Port
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXV5004GC7ULast Revision (GMT):
Thursday, 06 July 2023, 11:05:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CapTest Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Test Report
11 Jul 2023
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
20 Nov 2020
Test Report
21 Dec 2018
Test Report
21 Dec 2018
Test Report
21 Dec 2018
CDA 194Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
NI PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
PD PLATINGTest Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Test Report
3 Nov 2022
Die Encapsulant 1Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Die Encapsulant 2Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Test Report
11 Dec 2023
Epoxy Adhesive 1Test Report
14 Sep 2020
Test Report
14 Sep 2020
Test Report
14 Sep 2020
Test Report
25 Nov 2020
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
PortTest Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Test Report
28 Dec 2023
Semiconductor DieTest Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
Test Report
2 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.