MRF6V12250HSR5

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NXP Semiconductors
Product content declaration of MRF6V12250HSR5Last Revision (GMT):
Thursday, 15 September 2022, 03:36:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF6V12250HSR5SOT1793-1CFM2F4516.333344 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 171 061782020-10-13NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-529.57222498.8450000.654784
Inorganic Silicon compoundsSilicon7440-21-30.3440541.1500000.007618
Nickel and its compoundsNickel, metal7440-02-00.0014960.0050000.000033
Subtotal29.917774100.00000000.662435
CapCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1748.98482296.00000016.583914
Inorganic Silicon compoundsSilicon dioxide7631-86-923.4057763.0000000.518247
Inorganic compoundsOther inorganic compounds7.8019251.0000000.172749
Subtotal780.192522100.000000017.274910
EpoxyInorganic Silicon compoundsSilicon dioxide7631-86-911.98124045.0000000.265287
Phenols and Phenolic Resins2-[[4-[2-[4-[1,1-bis[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenyl]propan-2-yl]phenoxy]methyl]oxirane115254-47-214.64373855.0000000.324240
Subtotal26.624977100.00000000.589526
Header Assembly/FlangeHeader Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1240.3201586.7963005.321134
Chromium and Chromium III compoundsChromium, metal7440-47-30.6647760.0188000.014719
Cobalt and its compoundsCobalt, metal7440-48-414.0699190.3979000.311534
Copper and its compoundsCopper, metal7440-50-8969.20137227.40920021.459917
Gold and its compoundsGold, metal7440-57-55.0247180.1421000.111257
Inorganic Silicon compoundsQuartz14808-60-70.7743940.0219000.017146
Iron and its compoundsIron, metal7439-89-6152.4070324.3101003.374575
Manganese and its compoundsManganese, metal7439-96-52.6767850.0757000.059269
Molybdenum and its compoundsMolybdenum, metal7439-98-71916.44391154.19740042.433624
Nickel and its compoundsNickel, metal7440-02-0138.3972263.9139003.064371
Organic compoundsbeta-Terpineol8000-41-71.9483600.0551000.043140
Palladium and its compoundsPalladium, metal7440-05-342.3653431.1981000.938047
PolymersEthyl cellulose9004-57-30.3854290.0109000.008534
Silver and its compoundsSilver, metal7440-22-441.1913771.1649000.912053
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-310.0034690.2829000.221495
Titanium and its compoundsTitanium (III, IV) oxide (Ti3O5)12065-65-50.1697300.0048000.003758
Subtotal3536.044000100.000000078.294575
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped59.81920098.0000001.324508
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2208002.0000000.027031
Subtotal61.040000100.00000001.351539
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-321.04458998.0000000.465966
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4294812.0000000.009510
Subtotal21.474070100.00000000.475476
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.6226081.0200000.013786
Inorganic Silicon compoundsSilicon, doped59.20904497.0004001.310998
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2083481.9796000.026755
Subtotal61.040000100.00000001.351539
Total4516.333344100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRF6V12250HSR5
Product content declaration of MRF6V12250HSR5
上次修订 Last Revision (GMT):
Thursday, 15 September 2022, 03:36:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
陶瓷的
Ceramic
OOOOOO

环氧胶
Epoxy
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRF6V12250HSR5Last Revision (GMT):
Thursday, 15 September 2022, 03:36:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
WHITE RESINTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Not Available
Header Assembly/FlangeAGCU SOLDERTest Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
ALLOYTest Report
18 Jun 2019
Test Report
18 Jun 2019
Test Report
24 Jun 2019
Test Report
24 Jun 2019
AU PLATINGTest Report
25 Aug 2020
Test Report
5 Apr 2018
Test Report
5 Apr 2018
Test Report
5 Apr 2018
CPC BOARDTest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Not Available
ELECTRIC CONDUCTOR (TUNGSTEN)Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
NICO PLATINGTest Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
PD PLATINGTest Report
10 Feb 2020
Test Report
10 Feb 2020
Not AvailableNot Available
Semiconductor Die 1Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 2Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 3Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.