MRF6V14300HSR5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MRF6V14300HSR5Last Revision (GMT):
Monday, 20 June 2022, 02:11:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF6V14300HSR5SOT1793-1CFM2F4601.937484 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 134 051782018-02-201NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-529.91478299.9900000.650048
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0029920.0100000.000065
Subtotal29.917774100.00000000.650113
CapCapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1760.31415394.23620016.521610
Epoxy ResinsProprietary Material-Other Epoxy resins17.6999622.1938000.384620
Inorganic Silicon compoundsQuartz14808-60-719.3337682.3963000.420122
Magnesium and its compoundsMagnesium-oxide1309-48-47.8914820.9781000.171482
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.5781350.1956000.034293
Subtotal806.817500100.000000017.532126
Header Assembly/FlangeHeader Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1129.4427483.5095002.812788
Cobalt and its compoundsCobalt, metal7440-48-43.1129700.0844000.067645
Copper and its compoundsCopper, metal7440-50-81560.99213342.32220033.920325
Gold and its compoundsGold, metal7440-57-554.8716281.4877001.192359
Inorganic Silicon compoundsSilicon7440-21-33.5592610.0965000.077343
Iron and its compoundsIron, metal7439-89-6155.8845514.2264003.387368
Magnesium and its compoundsMagnesium, metal7439-95-42.4195600.0656000.052577
Manganese and its compoundsManganese, metal7439-96-51.8220460.0494000.039593
Molybdenum and its compoundsMolybdenum, metal7439-98-71591.11860143.13900034.574972
Nickel and its compoundsNickel, metal7440-02-0157.4078414.2677003.420469
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0885210.0024000.001924
Silver and its compoundsSilver, metal7440-22-427.6331410.7492000.600468
Subtotal3688.353000100.000000080.147829
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-316.40043798.0000000.356381
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3347032.0000000.007273
Subtotal16.735140100.00000000.363654
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-319.89400098.0000000.432296
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4060002.0000000.008822
Subtotal20.300000100.00000000.441119
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-321.04458998.0000000.457298
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4294812.0000000.009333
Subtotal21.474070100.00000000.466631
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon, doped17.97320098.0000000.390557
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3668002.0000000.007971
Subtotal18.340000100.00000000.398528
Total4601.937484100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRF6V14300HSR5
Product content declaration of MRF6V14300HSR5
上次修订 Last Revision (GMT):
Monday, 20 June 2022, 02:11:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRF6V14300HSR5Last Revision (GMT):
Monday, 20 June 2022, 02:11:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
WHITE RESINTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Not Available
Header Assembly/FlangeALLOY 42Test Report
18 Jun 2019
Test Report
18 Jun 2019
Test Report
24 Jun 2019
Test Report
24 Jun 2019
AU PLATINGTest Report
25 Aug 2020
Not AvailableNot AvailableNot Available
FLANGETest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Not Available
Semiconductor Die 1Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 2Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 3Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 4Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.