MRF8S7170NR3

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MRF8S7170NR3Last Revision (GMT):
Monday, 22 April 2024, 11:06:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF8S7170NR3SOT1823-1FM2F3209.539934 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 171 335282023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-52.23971099.9900000.069783
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002240.0100000.000007
Subtotal2.239934100.00000000.069790
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8491.80984196.39550015.323375
Iron and its compoundsIron, metal7439-89-611.9897002.3500000.373564
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0867340.0170000.002702
Nickel and its compoundsNickel, metal7440-02-05.1020001.0000000.158964
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.4209150.0825000.013114
Tin and its compoundsTin, metal7440-31-50.1530600.0300000.004769
Zinc and its compoundsZinc, metal7440-66-60.6377500.1250000.019870
Subtotal510.200000100.000000015.896359
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-2125.71500015.0000003.916917
Inorganic Silicon compoundsSilica, vitreous60676-86-0666.28950079.50000020.759658
Inorganic Silicon compoundsSilicon dioxide7631-86-941.9050005.0000001.305639
Inorganic compoundsCarbon Black1333-86-44.1905000.5000000.130564
Subtotal838.100000100.000000026.112777
Header Assembly/FlangeCeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1164.72701089.4000005.132418
Chromium and Chromium III compoundsDichromium trioxide1308-38-911.0555046.0000000.344458
Inorganic Silicon compoundsSilicon dioxide7631-86-95.5277523.0000000.172229
Inorganic compoundsOther inorganic compounds2.9481341.6000000.091855
Subtotal184.258400100.00000005.740960
ConductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-14.69527518.4000000.146291
Inorganic compoundsOther inorganic compounds0.3572491.4000000.011131
Molybdenum and its compoundsMolybdenum, metal7439-98-70.6379452.5000000.019876
Tungsten and its compoundsTungsten, metal7440-33-719.82733177.7000000.617762
Subtotal25.517800100.00000000.795061
FlangeCopper and its compoundsCopper, metal7440-50-8658.67937251.80000020.522548
Molybdenum and its compoundsMolybdenum, metal7439-98-7612.90242848.20000019.096270
Subtotal1271.581800100.000000039.618819
Gold PlatingGold and its compoundsGold, metal7440-57-54.30815799.9990000.134230
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000430.0010000.000001
Subtotal4.308200100.00000000.134231
Iron AlloyIron and its compoundsIron, metal7439-89-659.87403858.0000001.865502
Nickel and its compoundsNickel, metal7440-02-043.35706242.0000001.350881
Subtotal103.231100100.00000003.216383
Metal BrazeCopper and its compoundsCopper, metal7440-50-89.09361628.0000000.283331
Silver and its compoundsSilver, metal7440-22-423.38358472.0000000.728565
Subtotal32.477200100.00000001.011896
Nickel Cobalt PlatingCobalt and its compoundsCobalt, metal7440-48-410.09113030.0000000.314410
Nickel and its compoundsNickel, metal7440-02-023.54597070.0000000.733625
Subtotal33.637100100.00000001.048035
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0019880.1000000.000062
Palladium and its compoundsPalladium, metal7440-05-31.98641299.9000000.061891
Subtotal1.988400100.00000000.061953
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0050000.0200000.000156
Tin and its compoundsTin, metal7440-31-524.99500099.9800000.778772
Subtotal25.000000100.00000000.778928
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.3304801.0200000.010297
Inorganic Silicon compoundsSilicon, doped31.42813097.0004000.979210
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6413901.9796000.019984
Subtotal32.400000100.00000001.009491
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.3304801.0200000.010297
Inorganic Silicon compoundsSilicon, doped31.42813097.0004000.979210
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6413901.9796000.019984
Subtotal32.400000100.00000001.009491
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-51.1444401.0200000.035657
Inorganic Silicon compoundsSilicon, doped108.83444997.0004003.390967
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2211111.9796000.069203
Subtotal112.200000100.00000003.495828
Total3209.539934100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRF8S7170NR3
Product content declaration of MRF8S7170NR3
上次修订 Last Revision (GMT):
Monday, 22 April 2024, 11:06:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装焊头/法兰
Header Assembly/Flange
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

法兰盘
Flange
OOOOOO

镀金材料
Gold Plating
OOOOOO

铁合金
Iron Alloy
OOOOOO

金属钎焊
Metal Braze
OOOOOO

镍钴电镀
Nickel Cobalt Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRF8S7170NR3Last Revision (GMT):
Monday, 22 April 2024, 11:06:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Copper Lead-FrameCDA 10200Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
NI PLATINGTest Report
20 Feb 2023
Test Report
20 Feb 2023
Test Report
20 Feb 2023
Test Report
20 Feb 2023
Die EncapsulantTest Report
26 May 2023
Test Report
26 May 2023
Test Report
26 May 2023
Test Report
26 May 2023
Header Assembly/FlangeNot AvailableNot AvailableNot AvailableNot Available
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 2Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.