MRFE6VP6300HSR5

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MRFE6VP6300HSR5Last Revision (GMT):
Monday, 20 June 2022, 01:03:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRFE6VP6300HSR5SOT1826-1CFM4F4624.840025 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 143 851782019-08-094NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-534.98967298.8450000.756560
Inorganic Silicon compoundsSilicon7440-21-30.4070831.1500000.008802
Nickel and its compoundsNickel, metal7440-02-00.0017700.0050000.000038
Subtotal35.398525100.00000000.765400
CapCapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1760.31415394.23620016.439794
Epoxy ResinsProprietary Material-Other Epoxy resins17.6999622.1938000.382715
Inorganic Silicon compoundsQuartz14808-60-719.3337682.3963000.418042
Magnesium and its compoundsMagnesium-oxide1309-48-47.8914820.9781000.170632
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.5781350.1956000.034123
Subtotal806.817500100.000000017.445306
Header Assembly/FlangeHeader Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1254.0796216.9424005.493804
Chromium and Chromium III compoundsChromium, metal7440-47-30.4574780.0125000.009892
Cobalt and its compoundsCobalt, metal7440-48-418.2076240.4975000.393692
Copper and its compoundsCopper, metal7440-50-81021.27022727.90490022.082282
Gold and its compoundsGold, metal7440-57-56.8145920.1862000.147348
Inorganic Silicon compoundsQuartz14808-60-71.0613490.0290000.022949
Iron and its compoundsIron, metal7439-89-6105.4797882.8821002.280723
Manganese and its compoundsManganese, metal7439-96-52.2398120.0612000.048430
Molybdenum and its compoundsMolybdenum, metal7439-98-72028.31105955.42100043.856891
Nickel and its compoundsNickel, metal7440-02-0115.4674473.1550002.496680
Organic compoundsbeta-Terpineol8000-41-72.6643520.0728000.057610
Palladium and its compoundsPalladium, metal7440-05-357.4885151.5708001.243038
PolymersEthyl cellulose9004-57-30.5379940.0147000.011633
Silver and its compoundsSilver, metal7440-22-434.9366800.9546000.755414
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-310.5768910.2890000.228697
Titanium and its compoundsTitanium (III, IV) oxide (Ti3O5)12065-65-50.2305690.0063000.004985
Subtotal3659.824000100.000000079.134067
Semiconductor DieSemiconductor DieGold and its compoundsGold, metal7440-57-51.2525601.0200000.027083
Inorganic Silicon compoundsSilicon, doped119.11649197.0004002.575581
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.4309491.9796000.052563
Subtotal122.800000100.00000002.655227
Total4624.840025100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRFE6VP6300HSR5
Product content declaration of MRFE6VP6300HSR5
上次修订 Last Revision (GMT):
Monday, 20 June 2022, 01:03:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRFE6VP6300HSR5Last Revision (GMT):
Monday, 20 June 2022, 01:03:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
Test Report
1 Oct 2021
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
WHITE RESINTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Not Available
Header Assembly/FlangeAGCU SOLDERTest Report
29 Apr 2020
Test Report
29 Apr 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
ALLOYTest Report
18 Jun 2019
Test Report
18 Jun 2019
Test Report
24 Jun 2019
Test Report
24 Jun 2019
AU PLATINGTest Report
25 Aug 2020
Test Report
25 Apr 2018
Test Report
25 Apr 2018
Test Report
25 Apr 2018
CPC BOARDTest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Not Available
ELECTRIC CONDUCTOR (TUNGSTEN)Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
NICO PLATINGTest Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
PD PLATINGTest Report
10 Feb 2020
Test Report
10 Feb 2020
Not AvailableNot Available
Semiconductor DieTest Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.