MSC7119VF1200

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MSC7119VF1200Last Revision (GMT):
Tuesday, 12 April 2022, 07:20:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MSC7119VF1200SOT1512-2LFBGA400460.889350 mg NoNoNoNickel/Gold (Ni/Au)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 253 535572022-07-1312Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-55.09984099.9900001.106521
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005100.0100000.000111
Subtotal5.100350100.00000001.106632
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.93500045.0000000.419841
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0004300.0100000.000093
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.2150005.0000000.046649
PolymersPlastic: EP - Epoxide, Epoxy2.14957049.9900000.466396
Subtotal4.300000100.00000000.932979
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-332.83000098.0000007.123185
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6700002.0000000.145371
Subtotal33.500000100.00000007.268556
Solder Ball - Low LeadSolder Ball - Low LeadAluminum and its compoundsAluminum, metal7429-90-50.0031000.0025000.000673
Antimony and its compoundsAntimony, metal7440-36-00.0123990.0100000.002690
Arsenic and its compoundsArsenic, metal7440-38-20.0123990.0100000.002690
Bismuth and its compoundsBismuth, metal7440-69-90.0185980.0150000.004035
Cadmium and its compoundsCadmium, metal7440-43-90.0012400.0010000.000269
Copper and its compoundsCopper, metal7440-50-80.0062000.0050000.001345
Gold and its compoundsGold, metal7440-57-50.0062000.0050000.001345
Indium and its compoundsIndium, metal7440-74-60.0062000.0050000.001345
Inorganic compoundsSulfur7704-34-90.0012400.0010000.000269
Iron and its compoundsIron, metal7439-89-60.0123990.0100000.002690
Lead and its compoundsLead, metallic lead and lead alloys7439-92-144.60330735.9736009.677661
Nickel and its compoundsNickel, metal7440-02-00.0031000.0025000.000673
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0062000.0050000.001345
Silver and its compoundsSilver, metal7440-22-42.4779201.9985000.537639
Tin and its compoundsTin, metal7440-31-576.81664161.95440016.667046
Zinc and its compoundsZinc, metal7440-66-60.0018600.0015000.000403
Subtotal123.989000100.000000026.902119
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium sulfate7727-43-711.9364004.0600002.589862
Copper and its compoundsCopper, metal7440-50-868.96505023.45750014.963472
Epoxy ResinsOther Epoxy resins16.1700005.5000003.508434
Gold and its compoundsGold, metal7440-57-50.1176000.0400000.025516
Halogenated Compounds - SpecificPropanil709-98-883.93700028.55000018.211963
Halogenated Organic CompoundsOther halogenated organic compounds0.0808500.0275000.017542
Inorganic Silicon compoundsQuartz14808-60-7109.07400037.10000023.665984
Nickel and its compoundsNickel, metal7440-02-01.8081000.6150000.392307
PolymersOther polymers1.9110000.6500000.414633
Subtotal294.000000100.000000063.789714
Total460.889350100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MSC7119VF1200
Product content declaration of MSC7119VF1200
上次修订 Last Revision (GMT):
Tuesday, 12 April 2022, 07:20:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊球 - 低铅
Solder Ball - Low Lead
焊球 - 低铅
Solder Ball - Low Lead
XOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MSC7119VF1200Last Revision (GMT):
Tuesday, 12 April 2022, 07:20:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAUS308Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
E679FG SERIESTest Report
14 Dec 2022
Test Report
21 Dec 2021
Test Report
14 Dec 2022
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.