MSC7119VM1200

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MSC7119VM1200Last Revision (GMT):
Saturday, 17 December 2022, 11:39:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MSC7119VM1200SOT1512-2LFBGA400858.924350 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 241 545572021-06-1693 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-55.09984099.9900000.593747
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0005100.0100000.000059
Subtotal5.100350100.00000000.593807
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins23.9040006.0000002.783016
Inorganic Silicon compoundsSilica, vitreous60676-86-0294.81600074.00000034.323861
Inorganic Silicon compoundsSilicon dioxide7631-86-959.76000015.0000006.957539
Inorganic compoundsCarbon Black1333-86-41.9920000.5000000.231918
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-47.9680002.0000000.927672
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.9600002.5000001.159590
Subtotal398.400000100.000000046.383596
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.93500045.0000000.225282
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0004300.0100000.000050
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.2150005.0000000.025031
PolymersPlastic: EP - Epoxide, Epoxy2.14957049.9900000.250263
Subtotal4.300000100.00000000.500626
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-332.83000098.0000003.822223
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6700002.0000000.078005
Subtotal33.500000100.00000003.900227
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0038320.0031000.000446
Antimony and its compoundsAntimony, metal7440-36-00.0154530.0125000.001799
Arsenic and its compoundsArsenic, metal7440-38-20.0091480.0074000.001065
Bismuth and its compoundsBismuth, metal7440-69-90.0231180.0187000.002691
Cadmium and its compoundsCadmium, metal7440-43-90.0014840.0012000.000173
Copper and its compoundsCopper, metal7440-50-80.6173780.4994000.071878
Gold and its compoundsGold, metal7440-57-50.0076650.0062000.000892
Iron and its compoundsIron, metal7439-89-60.0154530.0125000.001799
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0463590.0375000.005397
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0161950.0131000.001886
Nickel and its compoundsNickel, metal7440-02-00.0038320.0031000.000446
Silver and its compoundsSilver, metal7440-22-44.9391503.9953000.575039
Tin and its compoundsTin, metal7440-31-5117.92258595.38810013.729100
Zinc and its compoundsZinc, metal7440-66-60.0023490.0019000.000273
Subtotal123.624000100.000000014.392886
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-893.01229899.99000010.828928
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0093020.0100000.001083
Subtotal93.021600100.000000010.830011
Copper PlatingCopper and its compoundsCopper, metal7440-50-894.47270299.98000010.998955
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0188980.0200000.002200
Subtotal94.491600100.000000011.001155
Gold PlatingGold and its compoundsGold, metal7440-57-50.99950099.9900000.116366
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001000.0100000.000012
Subtotal0.999600100.00000000.116378
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0018790.0300000.000219
Nickel and its compoundsNickel, metal7440-02-06.26032199.9700000.728856
Subtotal6.262200100.00000000.729075
Solder MaskBarium and its compoundsBarium sulfate7727-43-710.18092629.1000001.185311
Inorganic Silicon compoundsSilicon dioxide7631-86-90.2099160.6000000.024439
Magnesium and its compoundsTalc14807-96-61.0495803.0000000.122197
Organic compoundsOther organic compounds.1.2594963.6000000.146636
PolymersPlastic: EP - Epoxide, Epoxy6.85725619.6000000.798354
PolymersPlastic: PAK15.42882644.1000001.796296
Subtotal34.986000100.00000004.073234
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-36.61351246.6700000.769976
Inorganic Silicon compoundsSilica, vitreous60676-86-00.9437756.6600000.109879
PolymersPlastic: PI - Polyimide6.61351246.6700000.769976
Subtotal14.170800100.00000001.649831
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-318.52523437.0000002.156795
Inorganic Silicon compoundsSilica, vitreous60676-86-08.01091216.0000000.932668
PolymersPlastic: PI - Polyimide23.53205447.0000002.739712
Subtotal50.068200100.00000005.829175
Total858.924350100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MSC7119VM1200
Product content declaration of MSC7119VM1200
上次修订 Last Revision (GMT):
Saturday, 17 December 2022, 11:39:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MSC7119VM1200Last Revision (GMT):
Saturday, 17 December 2022, 11:39:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Die EncapsulantTest Report
7 Dec 2022
Test Report
7 Dec 2022
Test Report
7 Dec 2022
Test Report
7 Dec 2022
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - SAC, Lead FreeTest Report
8 Mar 2023
Test Report
8 Mar 2023
Test Report
8 Mar 2023
Test Report
8 Mar 2023
Substrate, Pre-plated NiAuAU PLATINGTest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
AUS 308Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
Test Report
26 Aug 2022
CU FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
CU PLATINGTest Report
17 May 2022
Test Report
17 May 2022
Test Report
17 May 2022
Test Report
17 May 2022
E679FGTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
NI PLATINGTest Report
5 Jun 2022
Test Report
5 Jun 2022
Test Report
5 Jun 2022
Test Report
5 Jun 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.