MVF61NN152CMK50
As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.
Download
| NXP Semiconductors | ||
| Product content declaration of MVF61NN152CMK50 | Last Revision (GMT): Friday, 20 March 2026, 03:36:00 AM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MVF61NN152CMK50 | SOT1517-1 | LFBGA364 | 1274.038032 mg | Yes | Yes | Yes | Nickel/Gold (Ni/Au) | Other | e1 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9353 397 46551 | 2025-01-16 | P | 3 / 168 hours | 260 | 40 sec. | Not Applicable | Not Applicable | Not Applicable | 3 | Tianjin, China;External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - CuPd | Bonding Wire - CuPd | Copper and its compounds | Copper, metal | 7440-50-8 | 0.852231 | 98.099400 | 0.066892 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.000869 | 0.100000 | 0.000068 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.015643 | 1.800600 | 0.001228 | ||
| Subtotal | 0.868742 | 100.0000000 | 0.068188 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 34.200000 | 5.000000 | 2.684378 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 458.280000 | 67.000000 | 35.970669 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 171.000000 | 25.000000 | 13.421891 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 3.420000 | 0.500000 | 0.268438 | ||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 17.100000 | 2.500000 | 1.342189 | |||
| Subtotal | 684.000000 | 100.0000000 | 53.687565 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 1.680000 | 16.000000 | 0.131864 |
| Organic Silicon compounds | Silylated silica | 68909-20-6 | 3.885000 | 37.000000 | 0.304936 | ||
| Organic compounds | Other Bismaleimides | 4.830000 | 46.000000 | 0.379110 | |||
| PFAS compounds | Ethene, 1,1,2,2-tetrafluoro-, oxidized, polymd., reduced, Me esters, reduced, 2,3-dihydroxypropyl ethers | 925918-64-5 | 0.105000 | 1.000000 | 0.008242 | ||
| Subtotal | 10.500000 | 100.0000000 | 0.824151 | ||||
| Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 72.211584 | 98.000000 | 5.667930 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 1.473706 | 2.000000 | 0.115672 | |||
| Subtotal | 73.685290 | 100.0000000 | 5.783602 | ||||
| Solder Ball - SAC, Lead Free (Ag > 1.5%) | Solder Ball - SAC, Lead Free (Ag > 1.5%) | Copper and its compounds | Copper, metal | 7440-50-8 | 0.452734 | 0.500900 | 0.035535 |
| Silver and its compounds | Silver, metal | 7440-22-4 | 2.716401 | 3.005400 | 0.213212 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 87.214866 | 96.493700 | 6.845547 | ||
| Subtotal | 90.384000 | 100.0000000 | 7.094294 | ||||
| Substrate, Pre-plated NiAu | Copper Foil | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.008195 | 0.005000 | 0.000643 |
| Copper and its compounds | Copper, metal | 7440-50-8 | 163.776909 | 99.925000 | 12.854947 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.081950 | 0.050000 | 0.006432 | ||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.032780 | 0.020000 | 0.002573 | ||
| Subtotal | 163.899834 | 100.0000000 | 12.864595 | ||||
| Solder Mask | Aromatic amines and their salts | 1,3,5-Triazine-2,4,6-triamine | 108-78-1 | 0.073168 | 0.100000 | 0.005743 | |
| Barium and its compounds | Barium sulfate | 7727-43-7 | 21.292014 | 29.100000 | 1.671223 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.439011 | 0.600000 | 0.034458 | ||
| Magnesium and its compounds | Talc | 14807-96-6 | 2.195053 | 3.000000 | 0.172291 | ||
| Organic compounds | Other organic compounds. | 2.634064 | 3.600000 | 0.206749 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 14.267845 | 19.500000 | 1.119892 | |||
| Polymers | Plastic: PAK | 32.267279 | 44.100000 | 2.532678 | |||
| Subtotal | 73.168434 | 100.0000000 | 5.743034 | ||||
| Substrate Core | Aluminum and its compounds | Aluminum hydroxide oxide | 24623-77-6 | 52.016798 | 29.300000 | 4.082829 | |
| Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 46.158250 | 26.000000 | 3.622988 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 3.018039 | 1.700000 | 0.236888 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 14.557602 | 8.200000 | 1.142635 | |||
| Phenols - Specific | Bisphenol A | 80-05-7 | 1.775317 | 1.000000 | 0.139346 | ||
| Polymers | BT Resin (CAS# 13676-54-5/25722-66-1) | 34.973751 | 19.700000 | 2.745111 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 25.031974 | 14.100000 | 1.964775 | |||
| Subtotal | 177.531732 | 100.0000000 | 13.934571 | ||||
| Total | 1274.038032 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MVF61NN152CMK50 Product content declaration of MVF61NN152CMK50 | 上次修订 Last Revision (GMT): Friday, 20 March 2026, 03:36:00 AM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | 邻苯二甲酸二正丁酯(DBP) | 邻苯二甲酸二异丁酯(DIBP) | 邻苯二甲酸丁基苄酯(BBP) | 邻苯二甲酸二（2-乙基）己酯(DEHP) | ||
| 焊丝-铜钯 Bonding Wire - CuPd | 焊丝-铜钯 Bonding Wire - CuPd | O | O | O | O | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Semiconductor Die | O | O | O | O | O | O | O | O | O | O |
| 焊锡球-铅银铜，无铅 Solder Ball - SAC, Lead Free (Ag > 1.5%) | 焊锡球-铅银铜，无铅 Solder Ball - SAC, Lead Free (Ag > 1.5%) | O | O | O | O | O | O | O | O | O | O |
| 基板，镍金预镀 Substrate, Pre-plated NiAu | 铜箔 Copper Foil | O | O | O | O | O | O | O | O | O | O |
| | 阻焊层 Solder Mask | O | O | O | O | O | O | O | O | O | O |
| | 有机基质芯 Substrate Core | O | O | O | O | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 | |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. | |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 | |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. | |
| 备注： 该半导体产品具有无限期的环保使用期限（EFUP）。 Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). | .jpg) |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MVF61NN152CMK50 | Last Revision (GMT): Friday, 20 March 2026, 03:36:00 AM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - CuPd | Test Report 4 Dec 2025 | Test Report 4 Dec 2025 | Test Report 4 Dec 2025 | Test Report 4 Dec 2025 | |
| Die Encapsulant | Test Report 4 Aug 2025 | Test Report 4 Aug 2025 | Test Report 4 Aug 2025 | Test Report 4 Aug 2025 | |
| Epoxy Adhesive | Test Report 10 Dec 2025 | Test Report 10 Dec 2025 | Test Report 10 Dec 2025 | Test Report 10 Dec 2025 | |
| Semiconductor Die | Test Report 18 Dec 2025 | Test Report 18 Dec 2025 | Test Report 18 Dec 2025 | Test Report 18 Dec 2025 | |
| Solder Ball - SAC, Lead Free (Ag > 1.5%) | Test Report 13 Mar 2026 | Test Report 13 Mar 2026 | Test Report 13 Mar 2026 | Test Report 13 Mar 2026 | |
| Substrate, Pre-plated NiAu | AU PLATING | Test Report 25 Mar 2026 | Test Report 25 Mar 2026 | Test Report 25 Mar 2026 | Test Report 25 Mar 2026 |
| AUS308 | Test Report 8 Apr 2026 | Test Report 8 Apr 2026 | Test Report 8 Apr 2026 | Test Report 8 Apr 2026 | |
| CORE | Test Report 6 Nov 2025 | Test Report 6 Nov 2025 | Not Available | Test Report 22 Nov 2024 | |
| CU FOIL | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | Test Report 18 Nov 2025 | |
| CU PLATING | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | |
| NI PLATING | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | Test Report 3 Mar 2026 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |