MW7IC3825NR1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MW7IC3825NR1Last Revision (GMT):
Monday, 16 May 2022, 11:33:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MW7IC3825NR1SOT1726-1FM16F1613.601128 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 093 125282020-01-243Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-54.09971899.9900000.254073
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0004100.0100000.000025
Subtotal4.100128100.00000000.254098
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-81014.02503396.99310062.842360
Iron and its compoundsIron, metal7439-89-612.1074841.1581000.750339
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2122290.0203000.013152
Nickel and its compoundsNickel, metal7440-02-019.1162541.8285001.184695
Subtotal1045.461000100.000000064.790547
Die EncapsulantDie EncapsulantAnhydridesBenzophenonetetracarboxylic Acid Dianhydride2421-28-540.5098097.4838002.510522
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-216.2038162.9935001.004202
Epoxy ResinsProprietary Material-Other Epoxy resins16.2038162.9935001.004202
Inorganic Silicon compoundsQuartz14808-60-716.2038162.9935001.004202
Inorganic Silicon compoundsSilica, vitreous60676-86-0432.10679979.82760026.779034
Magnesium and its compoundsMagnesium, metal7439-95-40.9662210.1785000.059880
Organic Silicon compoundsOther organic Silicon Compounds2.9019090.5361000.179841
PolymersPoly[(phenyl glycidyl ether)-co-dicyclopentadiene]119345-05-016.2038162.9935001.004202
Subtotal541.300000100.000000033.546085
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0019000.0200000.000118
Tin and its compoundsTin, metal7440-31-59.49810099.9800000.588627
Subtotal9.500000100.00000000.588745
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped5.58600098.0000000.346182
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1140002.0000000.007065
Subtotal5.700000100.00000000.353247
Solder WireSolder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-17.20070095.5000000.446250
Silver and its compoundsSilver, metal7440-22-40.1885002.5000000.011682
Tin and its compoundsTin, metal7440-31-50.1508002.0000000.009346
Subtotal7.540000100.00000000.467278
Total1613.601128100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MW7IC3825NR1
Product content declaration of MW7IC3825NR1
上次修订 Last Revision (GMT):
Monday, 16 May 2022, 11:33:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊丝
Solder Wire
焊丝
Solder Wire
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MW7IC3825NR1Last Revision (GMT):
Monday, 16 May 2022, 11:33:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Copper Lead-FrameCDA 10200Test Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
CDA 194Test Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
CDA 194 + NI PLATINGTest Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
Test Report
27 Aug 2021
Die EncapsulantTest Report
1 Jun 2021
Test Report
1 Jun 2021
Test Report
1 Jun 2021
Test Report
1 Jun 2021
Post-plating - Lead FreeTest Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Test Report
23 Jul 2021
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder WireTest Report
6 Nov 2020
Test Report
6 Nov 2020
Test Report
30 Nov 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.