NTB0102DP-Q100H

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of NTB0102DP-Q100HLast Revision (GMT):
Sunday, 04 December 2022, 03:47:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NTB0102DP-Q100HSOT505-1TSSOP818.326344 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 008 661252020-10-1621 / Unlimited26030 sec.1 / Unlimited24020 sec.3External manufacturing;Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000010.0020000.000006
Gold and its compoundsGold, metal7440-57-50.05114498.8400000.279072
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0080000.000023
Palladium and its compoundsPalladium, metal7440-05-30.0005951.1500000.003247
Subtotal0.051744100.00000000.282348
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-88.66800497.83300047.298052
Iron and its compoundsIron, metal7439-89-60.1861042.1005001.015502
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000890.0010000.000483
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0013380.0151000.007300
Zinc and its compoundsZinc, metal7440-66-60.0044650.0504000.024366
Subtotal8.860000100.000000048.345704
Die EncapsulantDie EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.0445000.5000000.242820
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-60.1780002.0000000.971279
Epoxy ResinsProprietary Material-Other Epoxy resins0.1780002.0000000.971279
Inorganic Silicon compoundsSilica, vitreous60676-86-07.65400086.00000041.765013
Inorganic compoundsCarbon Black1333-86-40.0445000.5000000.242820
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.0445000.5000000.242820
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.1335001.5000000.728460
Organic Silicon compoundsOther organic Silicon Compounds0.0445000.5000000.242820
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0445000.5000000.242820
Organic compoundsOther organic compounds.0.0445000.5000000.242820
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-20.3560004.0000001.942559
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0890001.0000000.485640
Zinc and its compoundsZinc Hydroxide20427-58-10.0445000.5000000.242820
Subtotal8.900000100.000000048.563969
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0179109.9500000.097728
Palladium and its compoundsProprietary Material-Other palladium compounds0.0000900.0500000.000491
PolymersAmines, C36-alkylenedi-, maleated682800-79-90.01800010.0000000.098219
Silver and its compoundsSilver, metal7440-22-40.14400080.0000000.785754
Subtotal0.180000100.00000000.982193
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0014001.0000000.007639
Nickel and its compoundsNickel, metal7440-02-00.12740091.0000000.695174
Palladium and its compoundsPalladium, metal7440-05-30.0112008.0000000.061114
Subtotal0.140000100.00000000.763928
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.19070898.0000001.040622
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0038922.0000000.021237
Subtotal0.194600100.00000001.061859
Total18.326344100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NTB0102DP-Q100H
Product content declaration of NTB0102DP-Q100H
上次修订 Last Revision (GMT):
Sunday, 04 December 2022, 03:47:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NTB0102DP-Q100HLast Revision (GMT):
Sunday, 04 December 2022, 03:47:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Test Report
22 Jul 2022
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
C194Test Report
3 Jan 2022
Test Report
3 Jan 2022
Test Report
3 Jan 2022
Test Report
3 Jan 2022
NI PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
PD PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Die EncapsulantTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.